公开(公告)号：US11156325B2

公开(公告)日：2021-10-26

申请号：US16459704

申请日：2019-07-02

Applicant: GOOGLE INC.

Inventor： Rafat E. Mehdi ,  Adam Scott Kilgore ,  Jason Evans Goulden

IPC: F16M11/10 ,  F16M13/02 ,  G03B17/55 ,  H04N5/225 ,  F16M11/04 ,  F16M11/06 ,  A47B97/00 ,  F16M11/20 ,  F16M13/00 ,  F16M11/14 ,  G03B17/08 ,  H04N7/18 ,  H05K7/20 ,  G03B17/56 ,  F21V21/30 ,  F21V21/088 ,  F16M11/38

Abstract: A stand assembly for an electronic device includes a neck portion with a first end that holds and extends from the electronic device, a spine portion that is coupled via a joint structure to a second end of the neck portion, the joint structure being configured to provide a first rotational degree of freedom of the neck portion with respect to the spine portion, and one or more interconnect wires. The one or more interconnect wires include a first wire portion, a second wire portion and a third wire portion, the first wire portion being routed through an interior of the neck portion, the second wire portion being routed along a surface of the spine portion, and the third wire portion being routed though the joint structure from the surface of the spine portion to the interior of the neck portion.

公开(公告)号：US20190323651A1

公开(公告)日：2019-10-24

申请号：US16459704

申请日：2019-07-02

Applicant: GOOGLE INC.

Inventor： Rafat E. Mehdi ,  Adam Scott Kilgore ,  Jason Evans Goulden

IPC: F16M11/20 ,  F16M11/10 ,  G03B17/08 ,  F16M11/14 ,  F16M13/00 ,  F16M13/02 ,  H05K7/20 ,  H04N5/225 ,  H04N7/18 ,  G03B17/55

Abstract: A stand assembly for an electronic device includes a neck portion with a first end that holds and extends from the electronic device, a spine portion that is coupled via a joint structure to a second end of the neck portion, the joint structure being configured to provide a first rotational degree of freedom of the neck portion with respect to the spine portion, and one or more interconnect wires. The one or more interconnect wires include a first wire portion, a second wire portion and a third wire portion, the first wire portion being routed through an interior of the neck portion, the second wire portion being routed along a surface of the spine portion, and the third wire portion being routed though the joint structure from the surface of the spine portion to the interior of the neck portion.

公开(公告)号：US10352496B2

公开(公告)日：2019-07-16

申请号：US15606888

申请日：2017-05-26

Applicant: GOOGLE INC.

Inventor： Rafat E. Mehdi ,  Adam Scott Kilgore ,  Jason Evans Goulden

IPC: F16M11/10 ,  F16M13/02 ,  F16M11/38 ,  F16M11/20 ,  H05K7/00 ,  F21V21/08 ,  F16M13/00 ,  G03B17/55 ,  H04N5/225 ,  H04N7/18 ,  H05K7/20 ,  F16M11/04 ,  F16M11/06 ,  A47B97/00 ,  G03B17/56 ,  F21V21/30 ,  F21V21/088

Abstract: A stand assembly for an electronic device includes a neck portion with a first end that holds and extends from the electronic device, a spine portion that is coupled via a joint structure to a second end of the neck portion, the joint structure being configured to provide a first rotational degree of freedom of the neck portion with respect to the spine portion, and one or more interconnect wires. The one or more interconnect wires include a first wire portion, a second wire portion and a third wire portion, the first wire portion being routed through an interior of the neck portion, the second wire portion being routed along a surface of the spine portion, and the third wire portion being routed though the joint structure from the surface of the spine portion to the interior of the neck portion.

公开(公告)号：US20180340646A1

公开(公告)日：2018-11-29

申请号：US15606888

申请日：2017-05-26

Applicant: GOOGLE INC.

Inventor： Rafat E. Mehdi ,  Adam Scott Kilgore ,  Jason Evans Goulden

IPC: F16M11/20 ,  F16M13/00 ,  F16M11/10 ,  F16M13/02

CPC classification number: F16M11/2035 ,  A47B2097/003 ,  F16M11/041 ,  F16M11/06 ,  F16M11/105 ,  F16M11/14 ,  F16M11/2007 ,  F16M11/2064 ,  F16M11/38 ,  F16M13/00 ,  F16M13/005 ,  F16M13/02 ,  F16M13/022 ,  F21V21/088 ,  F21V21/30 ,  G03B17/08 ,  G03B17/55 ,  G03B17/561 ,  H04N5/2252 ,  H04N5/2254 ,  H04N7/181 ,  H05K7/20445

Abstract: A stand assembly for an electronic device includes a neck portion with a first end that holds and extends from the electronic device, a spine portion that is coupled via a joint structure to a second end of the neck portion, the joint structure being configured to provide a first rotational degree of freedom of the neck portion with respect to the spine portion, and one or more interconnect wires. The one or more interconnect wires include a first wire portion, a second wire portion and a third wire portion, the first wire portion being routed through an interior of the neck portion, the second wire portion being routed along a surface of the spine portion, and the third wire portion being routed though the joint structure from the surface of the spine portion to the interior of the neck portion.