公开(公告)号：US09543254B2

公开(公告)日：2017-01-10

申请号：US14711109

申请日：2015-05-13

申请人： GLOBALFOUNDRIES INC.

发明人： Mark C. Lamorey ,  David B. Stone

IPC分类号： H01L23/00 ,  H01L23/58 ,  H01L21/768

CPC分类号： H01L23/562 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/585 ,  H01L2924/0002 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00

摘要： A corner crackstop is formed in each of the four corners of an integrated circuit (IC) chip, in which the corner crackstop differs structurally from a portion of the crackstop disposed along the sides of the IC chip. Each corner crackstop includes a plurality of layers, formed on a top surface of a silicon layer of the IC chip, within a perimeter boundary region that comprises a triangular area, in which a right angle is disposed on a bisector of the corner, equilateral sides of the triangle are parallel to sides of the IC chip, and the right angle is proximate to the corner relative to a hypotenuse of the triangle. The plurality of layers of the corner crackstop include crackstop elements, each comprising a metal cap centered over a via bar, in which the plurality of layers of the corner crackstop is chamfered to deflect crack ingress forces by each corner crackstop.

摘要翻译： 在集成电路（IC）芯片的四个角中的每一个角部形成有拐角裂缝，其中拐角裂缝在结构上与沿着IC芯片的侧面设置的裂纹阻挡部分不同。 每个角裂缝包括形成在IC芯片的硅层的顶表面上的多个层，所述多个层在包括三角形区域的周边边界区域内，其中直角设置在角部的二等分线上，等边侧 的三角形平行于IC芯片的两侧，并且直角相对于三角形的斜边接近角落。 多个角落裂缝的层包括裂缝阻挡元件，每个裂缝元件都包括以通孔杆为中心的金属盖，其中角部裂纹器的多个层被倒角以通过每个拐角裂缝挡块来偏转裂纹侵入力。

公开(公告)号：US20190287879A1

公开(公告)日：2019-09-19

申请号：US15921852

申请日：2018-03-15

申请人： GLOBALFOUNDRIES INC.

发明人： Wolfgang Sauter ,  Mark W. Kuemerle ,  Eric W. Tremble ,  David B. Stone ,  Nicholas A. Polomoff ,  Eric S. Parent ,  Jawahar P. Nayak ,  Seungman Choi

IPC分类号： H01L23/488 ,  H01L25/065

摘要： An IC chip structure including a plurality of IC chips electrically connected to one another in back-end-of-line (BEOL) interconnect layer of the structure is disclosed. The IC structure may include openings in crack-stop structures surrounding the IC chips and a interconnect wire extending between the IC chips through the openings. A packaging structure for utilizing the IC structure where at least one IC chip is inoperable is also disclosed. The structure may include a first bond pad array on a top surface of a packaging substrate including operable bond pads connected to an operable IC chip and structural support bond pads connected to the inoperable IC chip; a second bond pad array on a bottom surface of the substrate including operable bond pads connected to a single IC chip printed circuit board; and an interconnect structure for connecting the operable bond pads of the first and second bond pad arrays.

公开(公告)号：US10714411B2

公开(公告)日：2020-07-14

申请号：US15921852

申请日：2018-03-15

申请人： GLOBALFOUNDRIES INC.

发明人： Wolfgang Sauter ,  Mark W. Kuemerle ,  Eric W. Tremble ,  David B. Stone ,  Nicholas A. Polomoff ,  Eric S. Parent ,  Jawahar P. Nayak ,  Seungman Choi

IPC分类号： H01L23/48 ,  H01L23/488 ,  H01L25/065

摘要： An IC chip structure including a plurality of IC chips electrically connected to one another in back-end-of-line (BEOL) interconnect layer of the structure is disclosed. The IC structure may include openings in crack-stop structures surrounding the IC chips and a interconnect wire extending between the IC chips through the openings. A packaging structure for utilizing the IC structure where at least one IC chip is inoperable is also disclosed. The structure may include a first bond pad array on a top surface of a packaging substrate including operable bond pads connected to an operable IC chip and structural support bond pads connected to the inoperable IC chip; a second bond pad array on a bottom surface of the substrate including operable bond pads connected to a single IC chip printed circuit board; and an interconnect structure for connecting the operable bond pads of the first and second bond pad arrays.