公开(公告)号：US09279666B1

公开(公告)日：2016-03-08

申请号：US14558170

申请日：2014-12-02

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Mahadevan Balasubramaniam ,  Slawomir Rubinsztajn ,  Glen Peter Koste ,  Kaustubh Ravindra Nagarkar ,  Vincent Frank Rubino ,  Jeffrey Roy Rudd ,  Paul Jeffrey Gillespie

IPC: G01L1/24 ,  G01B11/16

CPC classification number: G01B11/165 ,  G01B11/18 ,  G01L1/246

Abstract: A system is provided for monitoring strain in a substrate using a strain sensor element within a fiber optic sensing cable. Accurate and rapid measurement of strain of remote substrates presents major technical challenges and is the focus of much of the description presented. However, systems, methods and devices provided by the present invention are not only capable of reliably measuring strain in real time, but are also capable of measuring other characteristics of a substrate such as its temperature, pressure and its acoustic characteristics. The system is configured such that a strain sensor element within a strain sensing zone detects substantially the true strain characteristics of the substrate. And while other sensing elements within the same fiber optic sensing cable may not be configured to detect substrate strain at all, these sensing elements may reliably measure the temperature and pressure at the surface of the substrate adjacent to the strain sensing zone.

Abstract translation: 提供一种系统，用于使用光纤传感电缆内的应变传感器元件来监测衬底中的应变。 对远程基板的应变的准确和快速测量提出了主要的技术挑战，并且是所提出的大部分描述的重点。 然而，本发明提供的系统，方法和装置不仅可以实时可靠地测量应变，而且能够测量诸如其温度，压力和其声学特性的基板的其它特性。 该系统被配置为使得应变传感区域内的应变传感器元件基本上检测到基板的真实应变特性。 而同一光纤传感电缆内的其它传感元件根本不能配置为检测基板应变，这些传感元件可以可靠地测量与应变感测区相邻的基板表面处的温度和压力。

公开(公告)号：US09814419B2

公开(公告)日：2017-11-14

申请号：US15092655

申请日：2016-04-07

Applicant: General Electric Company

Inventor： Jason Harris Karp ,  Christopher James Kapusta ,  Paul Jeffrey Gillespie ,  Christopher Fred Keimel ,  Jeffrey Michael Ashe ,  James Enrico Sabatini

IPC: A61B5/1455 ,  A61B5/00 ,  A61B5/029 ,  A61B5/08 ,  H01L25/075 ,  H05K1/18 ,  H01L33/62

CPC classification number: A61B5/14552 ,  A61B5/0002 ,  A61B5/029 ,  A61B5/0816 ,  A61B5/6826 ,  A61B5/742 ,  A61B2562/0238 ,  A61B2562/046 ,  A61B2562/12 ,  A61B2562/164 ,  A61B2562/222 ,  A61B2562/227 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/181 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/10151 ,  Y10T29/49139 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An array of emitters includes a device substrate having first and second sides, a thermally and electrically conductive layer disposed on the first side of the device substrate, and an interconnect layer disposed on a first plurality of portions of the second side of the device substrate. The array of the emitters further includes a plurality of emitters disposed in a second plurality of portions of the device substrate, where the plurality of emitters is electrically coupled to the thermally and electrically conductive layer. Also, the array of the emitters includes a plurality of wirebond contacts configured to electrically couple a portion of the interconnect layer to a corresponding emitter of the plurality of emitters, and a plurality of encapsulations, where one or more encapsulations of the plurality of encapsulations are disposed on at least a portion of a corresponding wirebond contact of the plurality of wirebond contacts.

公开(公告)号：US20160220158A1

公开(公告)日：2016-08-04

申请号：US15092655

申请日：2016-04-07

Applicant: General Electric Company

Inventor： Jason Harris Karp ,  Christopher James Kapusta ,  Paul Jeffrey Gillespie ,  Christopher Fred Keimel ,  Jeffrey Michael Ashe ,  James Enrico Sabatini

IPC: A61B5/1455 ,  A61B5/00

CPC classification number: A61B5/14552 ,  A61B5/0002 ,  A61B5/029 ,  A61B5/0816 ,  A61B5/6826 ,  A61B5/742 ,  A61B2562/0238 ,  A61B2562/046 ,  A61B2562/12 ,  A61B2562/164 ,  A61B2562/222 ,  A61B2562/227 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/181 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/10151 ,  Y10T29/49139 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An array of emitters includes a device substrate having first and second sides, a thermally and electrically conductive layer disposed on the first side of the device substrate, and an interconnect layer disposed on a first plurality of portions of the second side of the device substrate. The array of the emitters further includes a plurality of emitters disposed in a second plurality of portions of the device substrate, where the plurality of emitters is electrically coupled to the thermally and electrically conductive layer. Also, the array of the emitters includes a plurality of wirebond contacts configured to electrically couple a portion of the interconnect layer to a corresponding emitter of the plurality of emitters, and a plurality of encapsulations, where one or more encapsulations of the plurality of encapsulations are disposed on at least a portion of a corresponding wirebond contact of the plurality of wirebond contacts.

Abstract translation: 发射体阵列包括具有第一和第二侧的器件衬底，设置在器件衬底的第一侧上的导热层和布置在器件衬底的第二侧的第一多个部分上的互连层。 发射器的阵列还包括设置在器件衬底的第二多个部分中的多个发射器，其中多个发射极电耦合到导热层和导电层。 此外，发射器的阵列包括多个引线键合触点，其被配置为将互连层的一部分电耦合到多个发射体中的对应的发射极，以及多个封装，其中多个封装的一个或多个封装是 设置在所述多个引线接触件的对应的引线接合的至少一部分上。

公开(公告)号：US20150133753A1

公开(公告)日：2015-05-14

申请号：US14079660

申请日：2013-11-14

Applicant: General Electric Company

Inventor： Jason Harris Karp ,  Christopher James Kapusta ,  Paul Jeffrey Gillespie ,  Christopher Fred Keimel ,  Jeffrey Michael Ashe ,  James Enrico Sabatini

IPC: A61B5/1455 ,  H05K3/32

CPC classification number: A61B5/14552 ,  A61B5/0002 ,  A61B5/029 ,  A61B5/0816 ,  A61B5/6826 ,  A61B5/742 ,  A61B2562/0238 ,  A61B2562/046 ,  A61B2562/12 ,  A61B2562/164 ,  A61B2562/222 ,  A61B2562/227 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/181 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/10151 ,  Y10T29/49139 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An array of emitters includes a device substrate having first and second sides, a thermally and electrically conductive layer disposed on the first side of the device substrate, and an interconnect layer disposed on a first plurality of portions of the second side of the device substrate. The array of the emitters further includes a plurality of emitters disposed in a second plurality of portions of the device substrate, where the plurality of emitters is electrically coupled to the thermally and electrically conductive layer. Also, the array of the emitters includes a plurality of wirebond contacts configured to electrically couple a portion of the interconnect layer to a corresponding emitter of the plurality of emitters, and a plurality of encapsulations, where one or more encapsulations of the plurality of encapsulations are disposed on at least a portion of a corresponding wirebond contact of the plurality of wirebond contacts.

Abstract translation: 发射体阵列包括具有第一和第二侧的器件衬底，设置在器件衬底的第一侧上的导热层和布置在器件衬底的第二侧的第一多个部分上的互连层。 发射器的阵列还包括设置在器件衬底的第二多个部分中的多个发射器，其中多个发射极电耦合到导热层和导电层。 此外，发射器的阵列包括多个引线键合触点，其被配置为将互连层的一部分电耦合到多个发射体中的对应的发射极，以及多个封装，其中多个封装的一个或多个封装是 设置在所述多个引线接触件的对应的引线接合的至少一部分上。