公开(公告)号：US20210272961A1

公开(公告)日：2021-09-02

申请号：US17320244

申请日：2021-05-14

申请人： Fujian Jinhua Integrated Circuit Co., Ltd.

发明人： Yu-Cheng TUNG ,  Yi-Wang JHAN ,  Yung-Tai HUANG ,  Xiaopei FANG ,  Shaoyi WU ,  Yi-Lei TSENG

IPC分类号： H01L27/108

摘要： A contact structure, contact pad layout and structure, mask combination and manufacturing method thereof is provided in the present invention. Through the connection of tops of at least two contact plugs in the boundary of core region, an integrated contact with larger cross-sectional area is formed in the boundary of core region. Accordingly, the process of forming electronic components on the contact structure in the boundary of core region may be provided with sufficient process window to increase the size of electronic components in the boundary, lower contact resistance, and the electronic component with increased size in the boundary buffer the density difference of circuit patterns between the core region and the peripheral region, thereby improving optical proximity effect and ensuring the uniformity of electronic components on the contact plugs inside the boundary of core region, and avoiding the collapse of electronic components on the contact plug in the boundary.