Separation device of molecules and production method thereof
    2.
    发明授权
    Separation device of molecules and production method thereof 有权
    分子分离装置及其制备方法

    公开(公告)号:US08202496B2

    公开(公告)日:2012-06-19

    申请号:US12379468

    申请日:2009-02-23

    Abstract: A molecule is separated from a liquid sample containing said molecule and at least one additional molecule having a larger hydrodynamic diameter than the hydrodynamic diameter of the molecule to be separated, by means of a separation device comprising a substrate, at least one circulation channel arranged in said substrate, and at least one nanotube associated with said molecule to be separated and formed on a free surface of the substrate. Separation is achieved by means of the internal channel of a nanotube, such as a carbon nanotube, presenting an effective diameter chosen in predetermined and controlled manner. The effective diameter of the internal channel is chosen such as to be larger than the hydrodynamic diameter of the molecule to be separated and smaller than the hydrodynamic diameter of the additional molecules of larger hydrodynamic diameters.

    Abstract translation: 通过包括基底的分离装置将分子从含有所述分子的液体样品和至少一个具有比要分离的分子的流体动力学直径更大的流体动力学直径的另外的分子分离,至少一个循环通道被布置在 所述基底和至少一个与所述待分离的分子缔合的纳米管,所述分子被形成在所述基底的自由表面上。 通过纳米管的内部通道(例如碳纳米管)实现分离,其具有以预定和受控的方式选择的有效直径。 内部通道的有效直径选择为大于要分离的分子的流体动力学直径,并且小于较大流体动力学直径的附加分子的流体动力学直径。

    Method for manufacturing an interconnection structure with cavities for an integrated circuit
    3.
    发明授权
    Method for manufacturing an interconnection structure with cavities for an integrated circuit 有权
    用于制造具有用于集成电路的空腔的互连结构的方法

    公开(公告)号:US07960275B2

    公开(公告)日:2011-06-14

    申请号:US12046056

    申请日:2008-03-11

    Abstract: A method for manufacturing a structure of electrical interconnections for an integrated circuit having levels of interconnections, the method having steps of depositing a layer of sacrificial material on the substrate, etching the layer of sacrificial material with a pattern corresponding to electrical conductors, depositing, on the etched layer of the layer of sacrificial material, a layer of permeable membrane allowing an attack agent to break down the sacrificial material, breaking down the sacrificial material by using the attack agent to form air gaps to replace the broken down sacrificial material, forming electrical conductors in the etched track so as to obtain electrical interconnections separated by air gaps, and depositing a layer of insulating material to cover the electrical interconnections.

    Abstract translation: 一种用于制造具有互连电平的集成电路的电互连结构的方法,所述方法具有以下步骤:在所述衬底上沉积牺牲材料层,用对应于电导体的图案蚀刻所述牺牲材料层,沉积在 牺牲材料层的蚀刻层,允许攻击剂分解牺牲材料的可渗透膜层,通过使用攻击剂分解牺牲材料以形成气隙以代替破碎的牺牲材料,形成电 导体,以便获得由气隙分开的电互连,以及沉积一层绝缘材料以覆盖电互连。

Patent Agency Ranking