Curing System and Method
    1.
    发明申请
    Curing System and Method 审中-公开
    固化体系和方法

    公开(公告)号:US20150013177A1

    公开(公告)日:2015-01-15

    申请号:US14320170

    申请日:2014-06-30

    Abstract: A system including a curing system, including a first heating section, wherein the first heating section is configured to heat a device with a first radiant heat source, a second heating section coupled to the first heating section, wherein the second heating section is configured to heat the device with a second radiant heat source, and a controller system, configured to control the first and second heating sections based on a thermal curing profile for the device.

    Abstract translation: 一种包括固化系统的系统,包括第一加热部分,其中所述第一加热部分被配置为加热具有第一辐射热源的装置,耦合到所述第一加热部分的第二加热部分,其中所述第二加热部分被配置为 用第二辐射热源加热设备,以及控制器系统,其被配置为基于设备的热固化轮廓来控制第一和第二加热段。

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