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公开(公告)号:US20240372281A1
公开(公告)日:2024-11-07
申请号:US18579915
申请日:2023-03-10
Inventor: Yoshitane TORII , Shuichi KITAGAWA , Soki KUZUHARA
Abstract: An electrical contact material includes an electroconductive substrate, and a silver-containing layer including silver provided to at least part of a surface of the electroconductive substrate. An average CI value of the silver-containing layer is 0.6 or more in a cross section of the electrical contact material.
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公开(公告)号:US20240364032A1
公开(公告)日:2024-10-31
申请号:US18580026
申请日:2023-03-10
Inventor: Yoshitane TORII , Shuichi KITAGAWA , Soki KUZUHARA
IPC: H01R13/03
CPC classification number: H01R13/03
Abstract: An electrical contact material includes an electroconductive substrate, and a silver-containing layer including silver provided to at least part of a surface of the electroconductive substrate. An average KAM value of the silver-containing layer is 0.20° or more and 2.00° or less in a cross section of the electrical contact material.
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公开(公告)号:US20240321474A1
公开(公告)日:2024-09-26
申请号:US18579877
申请日:2023-03-10
Inventor: Yoshitane TORII , Shuichi KITAGAWA , Soki KUZUHARA
IPC: H01B1/02
CPC classification number: H01B1/02
Abstract: An electrical contact material includes an electroconductive substrate, and a silver-containing layer including silver provided to at least part of a surface of the electroconductive substrate. An average GOS value of the silver-containing layer is 1.00° or less and a proportion of KAM value of 1.00° or more in the silver-containing layer is 20% or more in a cross section of the electrical contact material.
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