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公开(公告)号：US11003044B2
公开(公告)日：2021-05-11
申请号：US16799770
申请日：2020-02-24
发明人： Hiroki Hara , Shinji Iwatsuka , Takashi Kikukawa , Toshinori Matsuura , Yasuhiro Ohmori , Masaharu Doi , Shintaro Takeuchi , Yoshinobu Kubota
摘要： An electro-optic device is provided with a Mach-Zehnder optical waveguide including at least one linear section and at least one curved section and a differential RF signal electrode provided along the Mach-Zehnder optical waveguide. Optical input/output ports of the Mach-Zehnder optical waveguide are provided at one end side in a first direction in which the linear section extends. The differential RF signal electrode is provided in both the linear and curved sections.
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公开(公告)号：US11003043B2
公开(公告)日：2021-05-11
申请号：US16799763
申请日：2020-02-24
发明人： Yasuhiro Ohmori , Masaharu Doi , Shintaro Takeuchi , Takehito Tanaka , Yoshinobu Kubota , Shinji Iwatsuka , Kenji Endou , Hiroki Hara , Toshinori Matsuura , Takashi Kikukawa
摘要： An optical modulator is provided with a ridge-shaped optical waveguide formed of a dielectric thin film having electro-optic effect, a buffer layer covering the optical waveguide, a signal electrode formed on the buffer layer so as to be opposed to the optical waveguide through the buffer layer; a ground electrode formed on the buffer layer together with the signal electrode, and a dielectric film having a higher dielectric constant than air and covering at least a part of exposed surfaces of the signal electrode and ground electrode and exposed surfaces of the buffer layer.
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公开(公告)号：US11086149B2
公开(公告)日：2021-08-10
申请号：US16832784
申请日：2020-03-27
发明人： Shinji Iwatsuka , Kenji Sasaki , Hiroki Hara , Yasuhiro Ohmori , Masaharu Doi , Shintaro Takeuchi , Yoshihiko Yoshida , Yoshinobu Kubota
摘要： An electro-optic device is provided with a substrate, an optical waveguide formed of a lithium niobate film with a ridge shape on the substrate, and an electrode that applies an electric field to the optical waveguide. The optical waveguide includes a first waveguide section provided at least in an electric field application region applied with the electric field and having a thickness of 1 μm or larger and a second waveguide section provided in a region other than the electric field application region and having a thickness of 0.3 μm or larger and less than 1 μm.
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公开(公告)号：US10989980B2
公开(公告)日：2021-04-27
申请号：US16799753
申请日：2020-02-24
发明人： Shinji Iwatsuka , Kenji Endou , Hiroki Hara , Toshinori Matsuura , Takashi Kikukawa , Yasuhiro Ohmori , Masaharu Doi , Shintaro Takeuchi , Takehito Tanaka , Yoshinobu Kubota
摘要： An optical modulator is provided with a substrate, first and second optical waveguides each formed of a ridge-shaped electro-optic material film and disposed so as to be mutually adjacent on the substrate, a buffer layer covering upper surfaces of the first and second optical waveguides, first and second signal electrodes provided above the buffer layer so as to be opposed respectively to the first and second optical waveguides, and a dielectric layer covering at least one of a part of an exposed surface of the first signal electrode and a part of an exposed surface of the second signal electrode, and a part of an upper surface of the buffer layer. Differential signals are applied to the first and second signal electrodes.
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公开(公告)号：US20200271963A1
公开(公告)日：2020-08-27
申请号：US16799753
申请日：2020-02-24
发明人： Shinji Iwatsuka , Kenji Endou , Hiroki Hara , Toshinori Matsuura , Takashi Kikukawa , Yasuhiro Ohmori , Masaharu Doi , Shintaro Takeuchi , Takehito Tanaka , Yoshinobu Kubota
摘要： An optical modulator is provided with a substrate, first and second optical waveguides each formed of a ridge-shaped electro-optic material film and disposed so as to be mutually adjacent on the substrate, a buffer layer covering upper surfaces of the first and second optical waveguides, first and second signal electrodes provided above the buffer layer so as to be opposed respectively to the first and second optical waveguides, and a dielectric layer covering at least one of a part of an exposed surface of the first signal electrode and a part of an exposed surface of the second signal electrode, and a part of an upper surface of the buffer layer. Differential signals are applied to the first and second signal electrodes.
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公开(公告)号：US11693290B2
公开(公告)日：2023-07-04
申请号：US17165562
申请日：2021-02-02
发明人： Shuntaro Makino , Yoshinobu Kubota , Yasuhiro Ohmori , Masaharu Doi , Teruo Kurahashi , Shintaro Takeuchi
CPC分类号： G02F1/225 , G02F1/035 , G02F1/0316 , G02F2201/07 , G02F2201/12 , G02F2202/20
摘要： An optical waveguide device includes a substrate on which an intermediate layer, a thin-film LN layer of lithium niobate, and a buffer layer are stacked; an optical waveguide formed in the thin-film LN layer; and a plurality of electrodes near the optical waveguide. The intermediate layer and the buffer layer contain a same material of a metal element of any one of group 3 of group 18 of a periodic table of elements.
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公开(公告)号：US10054744B2
公开(公告)日：2018-08-21
申请号：US15067949
申请日：2016-03-11
发明人： Masaharu Doi , Akira Ishii , Teruhiro Kubo , Yoshinobu Kubota
CPC分类号： G02B6/30 , G02B6/32 , G02B6/34 , G02F1/225 , G02F2203/02
摘要： An optical module includes a substrate on which an optical waveguide is formed, and an optical fiber assembly. The optical fiber assembly includes an optical fiber, a translucent member, and a mirror portion. The translucent member includes a joint surface joined to an end surface of the substrate at an end of the optical waveguide, and is attached to a distal end of the optical fiber. The mirror portion is formed on the translucent member, reflects light emitted from the distal end of the optical fiber in a direction different from a traveling direction of the light, and collects the reflected light into the end of the optical waveguide through the joint surface.
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公开(公告)号：US20180095225A1
公开(公告)日：2018-04-05
申请号：US15689617
申请日：2017-08-29
CPC分类号： G02B6/30 , G02F1/0311 , G02F1/035
摘要： An optical module includes a substrate on which an optical waveguide is provided; a housing that houses the substrate and includes a through path arranged on a side wall of the housing so as to extend in a direction that crosses the optical waveguide; a ferrule that houses an end portion of an optical fiber; and an optical path conversion element that is fixed on the ferrule, that is fixed on an end surface of the substrate on the end portion side of the optical waveguide, and that has a size smaller than a width of the substrate and a width of the ferrule along a longitudinal direction of the substrate. The end portion of the optical waveguide is arranged at a position close to the through path of the housing relative to a central portion in a width direction of the substrate.
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公开(公告)号：US20180031869A1
公开(公告)日：2018-02-01
申请号：US15617478
申请日：2017-06-08
CPC分类号： G02F1/0027 , G02F1/225 , G02F2001/212 , G02F2201/501
摘要： An optical modulator includes: a ferroelectric substrate in which an input optical waveguide, a pair of branched optical waveguides, and an output optical waveguide are formed; a signal electrode that is formed in a vicinity of at least one of the pair of branched optical waveguides; a first protection member that is attached to an input end of the ferroelectric substrate in which the input optical waveguide is formed; and a second protection member that is attached to an output end of the ferroelectric substrate in which the output optical waveguide is formed. The first protection member and the second protection member have a Mohs hardness that is less than or equal to a Mohs hardness of the ferroelectric substrate, and are formed of a glass material that does not have a pyroelectric effect.
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公开(公告)号：US09651804B2
公开(公告)日：2017-05-16
申请号：US14943736
申请日：2015-11-17
发明人： Masaki Sugiyama , Akira Ishii , Yoshinobu Kubota
CPC分类号： G02F1/0316 , G02B6/4201 , G02F1/035 , G02F1/225
摘要： An optical module includes a package, a substrate, a lead pin, and a ground pattern. The substrate is accommodated in the package, includes a signal line pattern that transmits an electric signal, extends toward a side wall of the package beyond an end of the signal line pattern, and has a through hole between the end of the signal line pattern and the side wall of the package. The lead pin is inserted into the through hole in the substrate and inputs the electric signal to the end of the signal line pattern. The ground pattern is provided in at least a part of regions surrounding the through hole on the substrate.
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