公开(公告)号：US20220104388A1

公开(公告)日：2022-03-31

申请号：US17481492

申请日：2021-09-22

Applicant: FUJITSU OPTICAL COMPONENTS LIMITED

Inventor： Kazuya SASAKI ,  Takatoshi YAGISAWA ,  Tsutomu OHTSU ,  Masami KAMIOKA

IPC: H05K7/20 ,  H05K7/14

Abstract: An optical communication module includes: a circuit board; optical communication devices that are provided on an upper surface side of the circuit board; a case that accommodates the circuit board and the optical communication devices; and a heatsink that is attached to the case. The optical communication devices include a first device and a second device. The first device is located closer to an inlet opening for cooling air for cooling the heatsink than the second device is. A height from the circuit board to a top of the first device is greater than a height from the circuit board to a top of the second device. The heatsink is not equipped with a cooling fin in a first region where the first device is provided, and the heatsink is equipped with a cooling fin in a second region where the second device is provided.