公开(公告)号：US20140029895A1

公开(公告)日：2014-01-30

申请号：US14040919

申请日：2013-09-30

Applicant: Fujitsu Optical Components Limited

Inventor： Kazuya SASAKI ,  Yasuo Tanaka

IPC: G02B6/36

CPC classification number: G02B6/36 ,  G02B6/4246 ,  G02B6/4261 ,  G02B6/4278 ,  G02B6/4284

Abstract: An optical module includes a rotating bail disposed on a front part of a case that is inserted into and removed from a cage; a slide plate that slides along a longitudinal direction of the case in conjunction with rotation of the bail; and an engagement member is disposed on the slide plate, freely engages with an engagement member of the cage, and is released from an engaged state by a sliding of the slide plate in conjunction with the rotation of the bail. The bail and the slide plate are formed by an integrated metal plate in a folded state.

Abstract translation: 光学模块包括设置在壳体前部的旋转吊环，所述壳体的前部插入和移出笼子; 结合所述吊环的旋转沿着所述壳体的纵向方向滑动的滑板; 并且接合构件设置在滑动板上，与保持架的接合构件自由接合，并且通过滑动板与拨号的旋转的滑动而从接合状态释放。 吊环和滑板由处于折叠状态的集成金属板形成。

公开(公告)号：US20220104388A1

公开(公告)日：2022-03-31

申请号：US17481492

申请日：2021-09-22

Applicant: FUJITSU OPTICAL COMPONENTS LIMITED

Inventor： Kazuya SASAKI ,  Takatoshi YAGISAWA ,  Tsutomu OHTSU ,  Masami KAMIOKA

IPC: H05K7/20 ,  H05K7/14

Abstract: An optical communication module includes: a circuit board; optical communication devices that are provided on an upper surface side of the circuit board; a case that accommodates the circuit board and the optical communication devices; and a heatsink that is attached to the case. The optical communication devices include a first device and a second device. The first device is located closer to an inlet opening for cooling air for cooling the heatsink than the second device is. A height from the circuit board to a top of the first device is greater than a height from the circuit board to a top of the second device. The heatsink is not equipped with a cooling fin in a first region where the first device is provided, and the heatsink is equipped with a cooling fin in a second region where the second device is provided.

公开(公告)号：US20230388021A1

公开(公告)日：2023-11-30

申请号：US18130015

申请日：2023-04-03

Applicant: Fujitsu Optical Components Limited

Inventor： Yasushi TAKAMIYA ,  Kazuya SASAKI ,  Tsuyoshi GAMO ,  Takatoshi YAGISAWA

IPC: H04B10/50

CPC classification number: H04B10/501

Abstract: An optical module includes a case that contains a built-in optical component related to optical communication, a built-in electronic component, and a built-in temperature sensor that detects temperature of at least one of the optical component and the electronic component. Furthermore, the optical module includes a flow channel that is formed on at least one of surfaces of the case, that extends in a longitudinal direction of the case, and through which air flows.