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公开(公告)号：US20230396864A1
公开(公告)日：2023-12-07
申请号：US18451123
申请日：2023-08-17
Applicant: FUJIFILM Corporation
Inventor： Takuro ABE , Kouhei Awazu , Yuta Abe , Yuta Watanabe
CPC classification number: H04N23/52 , H04N23/687 , H04N23/51
Abstract: An imaging element unit that is built in a housing of an imaging device includes an imaging element that includes an imaging surface imaging a subject and a back surface opposite to the imaging surface, an anti-vibration function that moves the imaging element in plane directions of the imaging surface, and a first heat conductive member to which driving heat of the imaging element is conducted from the back surface and which is deformed to be capable of following movement of the imaging element caused by the anti-vibration function. The first heat conductive member includes an outer layer portion and at least one inner layer portion that is connected to the outer layer portion and is disposed in a space surrounded by the outer layer portion, and the outer layer portion and the inner layer portion include bent portions that allow the first heat conductive member to be deformable.
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公开(公告)号：US11272107B2
公开(公告)日：2022-03-08
申请号：US17157788
申请日：2021-01-25
Applicant: FUJIFILM Corporation
Inventor： Kouhei Awazu , Yuta Abe
Abstract: An imaging device includes: an imager that is provided in a device body; a shutter that is provided in the device body, includes a support member and a shutter member; an actuator that is provided in the device body and moves the imager in a direction orthogonal to an optical axis to correct an amount of camera shake; and a plurality of elastic members that are disposed on at least one side and the other side of an imaginary straight line passing through a center of gravity of the shutter and orthogonal to the optical axis in a case where the plurality of elastic members are viewed in a direction of the optical axis and are in contact with the device body and the support member.
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