Abstract:
A curable resin composition containing a compound of formula (1), a compound of formula (2) and a thermal- or photo-radical polymerization initiator is capable of producing a cured product having a low Abbe's number and capable of realizing burr reduction in molding the composition. Ar1 to Ar4 represent aryl or heteroaryl, at least one of Ar1 to Ar4 is aromatic condensed ring, and two or more of Ar1 to Ar4 have a polymerizable group, and at least one of R21 to R26 forms a ring, or at least two bond to each other to form a ring:
Abstract:
A curable resin composition comprising a (meth)acrylate monomer having an aromatic ring, a non-conjugated vinylidene group-containing compound represented by the general formula below, and a thermal or a photo-radical polymerization initiator makes it possible to produce a cured product with minimized occurrence of burring during molding and high product yield after molding. The cured product has good heat coloration resistance and low Abbe's number. R11, R12, R15, and R16 represent a substituent and A represents an atomic group necessary for forming a cyclic structure.