公开(公告)号：US20150358558A1

公开(公告)日：2015-12-10

申请号：US14728967

申请日：2015-06-02

Applicant: FLIR Systems, Inc.

Inventor： Tiahaar Kurtheru Clayton McKenzie ,  Richard E. Bornfreund ,  Devin Leonard ,  Gregory A. Carlson

IPC: H04N5/33 ,  H01L21/66 ,  H01L21/78 ,  H01L27/146

CPC classification number: H01L21/78 ,  H01L21/67092 ,  H01L21/681 ,  H01L21/76251 ,  H01L27/14618 ,  H01L27/14649 ,  H01L27/14687 ,  Y10T83/533

Abstract: Systems and methods may be provided for generating reduced-height circuit packages such as infrared detector packages. An alignment and dicing system may include an infrared camera that captures images of alignment marks of a wafer assembly through a lid wafer of the wafer assembly, a light source that illuminates the alignment marks through the lid wafer, and dicing equipment that dices the wafer assembly based on infrared images captured using the infrared camera. The light source may illuminate the alignment marks through the lid wafer by providing light such as infrared light to the wafer assembly through optics of the infrared camera. The infrared camera may capture images of alignment marks formed on a detector wafer of the wafer assembly or on an interior or lower surface of the lid wafer through the lid wafer. The dicing equipment may be aligned with the wafer assembly based on the captured images.

Abstract translation: 可以提供系统和方法来产生诸如红外检测器封装的减小电路封装。 对准和切割系统可以包括红外相机，其通过晶片组件的盖晶片捕获晶片组件的对准标记的图像，通过盖晶片照亮对准标记的光源，以及切割晶片组件的切割设备 基于使用红外摄像机捕获的红外图像。 光源可以通过红外照相机的光学器件通过向晶片组件提供诸如红外光的光来通过盖晶片照亮对准标记。 红外相机可以通过盖晶片捕获形成在晶片组件的检测器晶片上的对准标记的图像或盖晶片的内表面或下表面上的图像。 切片设备可以基于所捕获的图像与晶片组件对准。

公开(公告)号：US10153204B2

公开(公告)日：2018-12-11

申请号：US14728967

申请日：2015-06-02

Applicant: FLIR Systems, Inc.

Inventor： Tiahaar Kurtheru Clayton McKenzie ,  Richard E. Bornfreund ,  Devin Leonard ,  Gregory A. Carlson

IPC: H01L21/78 ,  H01L27/146 ,  H01L21/68 ,  H01L21/67

Abstract: Systems and methods may be provided for generating reduced-height circuit packages such as infrared detector packages. An alignment and dicing system may include an infrared camera that captures images of alignment marks of a wafer assembly through a lid wafer of the wafer assembly, a light source that illuminates the alignment marks through the lid wafer, and dicing equipment that dices the wafer assembly based on infrared images captured using the infrared camera. The light source may illuminate the alignment marks through the lid wafer by providing light such as infrared light to the wafer assembly through optics of the infrared camera. The infrared camera may capture images of alignment marks formed on a detector wafer of the wafer assembly or on an interior or lower surface of the lid wafer through the lid wafer. The dicing equipment may be aligned with the wafer assembly based on the captured images.