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公开(公告)号：US10548222B1
公开(公告)日：2020-01-28
申请号：US16292625
申请日：2019-03-05
申请人： FLEX TEK CO., LTD.
发明人： Tsung-Her Yeh
摘要： Disclosures of the present invention mainly describe an embedded passive device structure, constituted by a first electrically conductive layer, a resistor layer, a dielectric layer, a support layer, a joint layer, and a second electrically conductive layer. Particularly, it is able to form an electronic circuit topology comprising at least one thin film resistor, at least one thin film capacitor and at least one thin film inductor on the embedded passive device structure by applying two times of photolithography processes to the embedded passive device structure. In addition, the resistor layer, formed on the first electrically conductive layer through sputter-coating process, is made of Ni, Cr, W, or compound thereof so as to show the lowest resistance less than or equal to 5 Ω/sq because of having good film continuity and surface densification. Moreover, the use of sputter-coating technology is helpful in reduction of industrial waste water.
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公开(公告)号：US10468163B1
公开(公告)日：2019-11-05
申请号：US16292618
申请日：2019-03-05
申请人： FLEX TEK CO., LTD.
发明人： Tsung-Her Yeh
摘要： Disclosures of the present invention mainly describe a copper film with buried film resistor. In the present invention, Ni, Cr, W, Ni-based compound, W-based compound, Ni-based alloy, or W-based alloy are adopted for the manufacture of a resistor layer, and a copper layer is processed to the copper film 1 with buried film resistor by being integrated with the resistor layer. Particularly, the resistor layer, formed on the copper layer through sputter-coating process, is able to show the lowest resistance less than or equal to 5 Ω/sq. Moreover, the use of sputter-coating technology is helpful in reduction of industrial waste water. In addition, at least one electronic circuit having at least one film resistor can be formed on a printed circuit board comprising the above-mentioned copper film by just needing to complete two times of photolithography processes on the printed circuit board.
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