公开(公告)号：US20190157002A1

公开(公告)日：2019-05-23

申请号：US16136425

申请日：2018-09-20

Applicant: FANUC CORPORATION

Inventor： Yuuki INOUE ,  Masaya TATEDA

IPC: H01G2/06 ,  H05K1/18

Abstract: A resin molded substrate has at least a pair of terminal through holes for allowing lead terminals of a cylindrical capacitor to be inserted through, and at least one protrusion for supporting a side of a bottom portion of the capacitor so as to space from a front surface of the substrate the side of the bottom portion of the capacitor having the lead terminals inserted through the terminal through holes. The pair of lead terminals at the bottom portion are inserted through the terminal through holes of the resin molded substrate, whereby the capacitor is mounted in an upright state with a solder, so that the protrusion spaces the side of the bottom portion from the front surface of the resin molded substrate.

公开(公告)号：US20200227206A1

公开(公告)日：2020-07-16

申请号：US16831641

申请日：2020-03-26

Applicant: FANUC CORPORATION

Inventor： Yuuki INOUE ,  Masaya TATEDA

IPC: H01G2/06 ,  H05K1/18 ,  H05K3/30

Abstract: A resin molded substrate has at least a pair of terminal through holes for allowing lead terminals of a cylindrical capacitor to be inserted through, and at least one protrusion for supporting a side of a bottom portion of the capacitor so as to space from a front surface of the substrate the side of the bottom portion of the capacitor having the lead terminals inserted through the terminal through holes. The pair of lead terminals at the bottom portion are inserted through the terminal through holes of the resin molded substrate, whereby the capacitor is mounted in an upright state with a solder, so that the protrusion spaces the side of the bottom portion from the front surface of the resin molded substrate.