公开(公告)号：US20190257877A1

公开(公告)日：2019-08-22

申请号：US16321984

申请日：2017-07-14

Applicant: Endress+Hauser Flowtec AG

Inventor： Thomas Böhler ,  Matthias Brudermann ,  Christoph Werle ,  Markus Wucher ,  Daniel Kollmer ,  Ludovic Adam

IPC: G01R31/28 ,  G01R31/04 ,  H05K5/00

Abstract: Disclosed is a test system for testing electric connections, in particular soldered connections, between electronic components and a printed circuit board to be tested, characterized in that the test system includes a subassembly, which is movably mounted in a housing of the test system, and a current and/or voltage source for energizing the circuit board to be tested, the current and/or voltage source being arranged in the housing of the test system in such a way as to be movable in at least two directions in space.

公开(公告)号：US10955492B2

公开(公告)日：2021-03-23

申请号：US16321961

申请日：2017-07-14

Applicant: Endress+Hauser Flowtec AG

Inventor： Thomas Böhler ,  Matthias Brudermann ,  Christoph Werle ,  Markus Wucher ,  Daniel Kollmer ,  Ludovic Adam

IPC: G01R31/71 ,  G01R31/28 ,  H01L21/00

Abstract: A test system for testing electric connections, in particular soldered connections, between electronic components and a printed circuit board to be tested, characterized in that the test system includes a subassembly, which is movably mounted in a housing of the test system, and a current and/or voltage source for energizing the circuit board to be tested, the current and/or voltage source being arranged in the housing of the test system in such a way as to be movable in at least two directions in space.

公开(公告)号：US10914791B2

公开(公告)日：2021-02-09

申请号：US16321925

申请日：2017-07-14

Applicant: Endress+Hauser Flowtec AG

Inventor： Thomas Böhler ,  Matthias Brudermann ,  Christoph Werle ,  Markus Wucher ,  Daniel Kollmer ,  Ludovic Adam

IPC: G01R31/04 ,  G01R31/70 ,  G01R31/28

Abstract: A test system for testing electrical connections, especially soldered connections, between electronic components and a circuit board to be tested, characterized in that the test system has a communication interface, which by contacting the circuit board enables a data exchange with a data memory or a communication module of the circuit board to be tested, wherein the communication interface is arranged within a housing of the test system freely movably in at least two spatial directions, preferably three spatial directions.

公开(公告)号：US10989766B2

公开(公告)日：2021-04-27

申请号：US16321885

申请日：2017-07-03

Applicant: Endress+Hauser Flowtec AG

Inventor： Thomas Böhler ,  Matthias Brudermann ,  Christoph Werle ,  Markus Wucher ,  Daniel Kollmer ,  Ludovic Adam

IPC: G01R31/04 ,  G01R31/71 ,  G01R31/28 ,  G01R31/68 ,  H04L25/02 ,  H04L29/06

Abstract: A test system for checking electrical connections, especially solder connections, between electronic components with a circuit board to be checked, characterized in that the test system includes a communication interface with at least three electrically-conductive contact tips, which by contact with a contacting arrangement on the circuit board having a number of contacting locations enable a data exchange with a data memory and/or a communication module of a circuit board, wherein the data exchange occurs according to a communication protocol.

公开(公告)号：US20190277903A1

公开(公告)日：2019-09-12

申请号：US16321925

申请日：2017-07-14

Applicant: Endress+Hauser Flowtec AG

Inventor： Thomas Böhler ,  Matthias Brudermann ,  Christoph Werle ,  Markus Wucher ,  Daniel Kollmer ,  Ludovic Adam

IPC: G01R31/04 ,  G01R31/28

Abstract: A test system for testing electrical connections, especially soldered connections, between electronic components and a circuit board to be tested, characterized in that the test system has a communication interface, which by contacting the circuit board enables a data exchange with a data memory or a communication module of the circuit board to be tested, wherein the communication interface is arranged within a housing of the test system freely movably in at least two spatial directions, preferably three spatial directions.

公开(公告)号：US10884052B2

公开(公告)日：2021-01-05

申请号：US16321984

申请日：2017-07-14

Applicant: Endress+Hauser Flowtec AG

Inventor： Thomas Böhler ,  Matthias Brudermann ,  Christoph Werle ,  Markus Wucher ,  Daniel Kollmer ,  Ludovic Adam

IPC: G01R31/28 ,  H05K5/00 ,  G01R31/70

Abstract: Disclosed is a test system for testing electric connections, in particular soldered connections, between electronic components and a printed circuit board to be tested, characterized in that the test system includes a subassembly, which is movably mounted in a housing of the test system, and a current and/or voltage source for energizing the circuit board to be tested, the current and/or voltage source being arranged in the housing of the test system in such a way as to be movable in at least two directions in space.

公开(公告)号：US20190265290A1

公开(公告)日：2019-08-29

申请号：US16321961

申请日：2017-07-14

Applicant: Endress+Hauser Flowtec AG

Inventor： Thomas Böhler ,  Matthias Brudermann ,  Christoph Werle ,  Markus Wucher ,  Daniel Kollmer ,  Ludovic Adam

IPC: G01R31/04 ,  G01R31/28

Abstract: A test system (1) for testing electric connections, in particular soldered connections, between electronic components and a printed circuit board (6) to be tested, characterized in that the test system (1) includes a subassembly, which is movably mounted in a housing (1a) of the test system, and a current and/or voltage source (14) for energizing the circuit board (6) to be tested, the current and/or voltage source (14) being arranged in the housing (1a) of the test system (1) in such a way as to be movable in at least two directions in space.

公开(公告)号：US11002785B2

公开(公告)日：2021-05-11

申请号：US16321869

申请日：2017-07-03

Applicant: Endress+Hauser Flowtec AG

Inventor： Thomas Böhler ,  Matthias Brudermann ,  Christoph Werle ,  Markus Wucher ,  Daniel Kollmer ,  Ludovic Adam

IPC: G01R31/28 ,  H05K1/02 ,  G01R31/68 ,  G01R31/71

Abstract: A circuit board comprising a contacting arrangement, including three metal contacting regions, which are connected with one or more data links of the circuit board and in the case of contact with a communication interface of a test system enable a data exchange with a data memory of a circuit board.

公开(公告)号：US20190265289A1

公开(公告)日：2019-08-29

申请号：US16321885

申请日：2017-07-03

Applicant: Endress+Hauser Flowtec AG

Inventor： Thomas Böhler ,  Matthias Brudermann ,  Christoph Werle ,  Markus Wucher ,  Daniel Kollmer ,  Ludovic Adam

IPC: G01R31/04 ,  G01R31/28

Abstract: A test system for checking electrical connections, especially solder connections, between electronic components with a circuit board to be checked, characterized in that the test system includes a communication interface with at least three electrically-conductive contact tips, which by contact with a contacting arrangement on the circuit board having a number of contacting locations enable a data exchange with a data memory and/or a communication module of a circuit board, wherein the data exchange occurs according to a communication protocol.

公开(公告)号：US20190235015A1

公开(公告)日：2019-08-01

申请号：US16321869

申请日：2017-07-03

Applicant: Endress+Hauser Flowtec AG

Inventor： Thomas Böhler ,  Matthias Brudermann ,  Christoph Werle ,  Markus Wucher ,  Daniel Kollmer ,  Ludovic Adam

IPC: G01R31/28 ,  G01R31/04 ,  H05K1/02

CPC classification number: G01R31/2818 ,  G01R31/043 ,  G01R31/048 ,  H05K1/0268 ,  H05K2201/09927 ,  H05K2203/162

Abstract: A circuit board comprising a contacting arrangement, including three metal contacting regions, which are connected with one or more data links of the circuit board and in the case of contact with a communication interface of a test system enable a data exchange with a data memory of a circuit board.