Abstract:
A humidity sensor is provided. The humidity sensor includes a flexible substrate, a moisture absorption prevention layer covering the flexible substrate, a dielectric layer on the moisture absorption prevention layer, hydrophobic patterns on the dielectric layer, a first electrode between the moisture absorption prevention layer and the dielectric layer, and a second electrode spaced apart from the first electrode between the moisture absorption prevention layer and the dielectric layer. The first electrode has a thickness greater than that of the moisture absorption prevention layer.
Abstract:
Provided are a micro electro mechanical system (MEMS) acoustic sensor for removing a nonlinear component that occurs due to a vertical motion of a lower electrode when external sound pressure is received by fixing the lower electrode to a substrate using a fixing pin, and a fabrication method thereof. The MEMS acoustic sensor removes an undesired vertical motion of a fixed electrode when sound pressure is received by forming a fixing groove on a portion of the substrate and then forming a fixing pin on the fixing groove, and fixing the fixed electrode to the substrate using the fixing pin, and thereby improves a frequency response characteristic and also improves a yield of a process by inhibiting thermal deformation of the fixed electrode that may occur during the process.
Abstract:
Provided is an acoustic sensor. The acoustic sensor includes: a substrate including sidewall portions and a bottom portion extending from a bottom of the sidewall portions; a lower electrode fixed at the substrate and including a concave portion and a convex portion, the concave portion including a first hole on a middle region of the bottom, the convex portion including a second hole on an edge region of the bottom; diaphragms facing the concave portion of the lower electrode, with a vibration space therebetween; diaphragm supporters provided on the lower electrode at a side of the diaphragm and having a top surface having the same height as the diaphragm; and an acoustic chamber provided in a space between the bottom portion and the sidewall portions below the lower electrode.
Abstract:
Provided are a radio frequency identification tag and a method of manufacturing the same. The radio frequency identification tag includes a substrate, an antenna unit provided on the substrate and configured to transmit and receive signals, an integrated circuit unit spaced apart from the antenna unit on the substrate, and an interrupter and a delay circuit unit connected in parallel between the antenna unit and the integrated circuit unit, wherein the interrupter includes a variable portion and a fixed portion opposite the variable portion, wherein the delay circuit unit includes a capacitor and a resistor.
Abstract:
Provided is a cover window including a film portion on the substrate. The cover window may include a substrate, and a film portion on the substrate. The film portion includes polyurea, wherein the polyurea may be a polymer formed through a urea bond between an aliphatic polyisocyanate and an aliphatic polyamine.
Abstract:
Provided is a capacitor-type sensor read-out circuit. The capacitor-type sensor read-out circuit includes: a signal conversion unit outputting a sensor signal inputted from a sensor; a voltage booster generating a bias voltage; and a capacitor-type signal coupling circuit receiving the sensor signal as a feedback, mixing the received sensor signal with the bias voltage, and outputting the mixed signal.
Abstract:
Provided are an acoustic sensor and a method of manufacturing the same. The acoustic sensor includes a substrate including an acoustic chamber, a first hole, and a second hole, penetrating the substrate, a lower electrode pad extended onto a top surface of the substrate while covering a sidewall of the first hole, a diaphragm pad extended onto the top surface of the substrate while covering a sidewall of the second hole, a lower electrode provided on the acoustic chamber and connected to the lower electrode pad, and a diaphragm above the lower electrode while being separated from the lower electrode and connected to the diaphragm pad.
Abstract:
Provided is a humidity sensor including a support body, an RFID chip, an antenna, and a capacitor on the support body, a top cover sheet on the RFID chip and the antenna, and a hydrophobic material pattern on the capacitor, wherein the capacitor is exposed by the top cover sheet, the hydrophobic material pattern has a network shape including a plurality of holes, and an electrostatic capacitance of the capacitor changes according to humidity.
Abstract:
An MEMS microphone is provided which includes a reference voltage/current generator configured to generate a DC reference voltage and a reference current; a first noise filter configured to remove a noise of the DC reference voltage; a voltage booster configured to generate a sensor bias voltage using the DC reference voltage the noise of which is removed; a microphone sensor configured to receive the sensor bias voltage and to generate an output value based on a variation in a sound pressure; a bias circuit configured to receive the reference current to generate a bias voltage; and a signal amplification unit configured to receive the bias voltage and the output value of the microphone sensor to amplify the output value. The first noise filter comprises an impedance circuit; a capacitor circuit connected to a output node of the impedance circuit; and a switch connected to both ends of the impedance circuit.
Abstract:
Disclosed herein to a strain sensor and a method for fabricating the strain sensor. According to an embodiment of the present disclosure, there is provided a strain sensor. The strain sensor comprising: a stretchable piezoresistor formed by a composite of a conducting nanocarbon filler distributed within a matrix of an insulating elastomer; and a stretchable electrode which is formed by a composite of a metal filler distributed within the matrix of the insulating elastomer and is partially inserted into both ends of the stretchable piezoresistor, wherein resistance increases due to a longitudinal tensile strain of the piezoresistor.