公开(公告)号：US20250159854A1

公开(公告)日：2025-05-15

申请号：US18930350

申请日：2024-10-29

Applicant: Electronics and Telecommunications Research Institute

Inventor： HAECHUNG KANG ,  Eun Kyu Kang ,  Jong Jin Lee ,  Sangjin Kwon ,  Won-Bae Kwon ,  Dae Woong Moon ,  Soo Yong Jung ,  GYE SUL CHO

IPC: H05K13/04 ,  B05C5/02 ,  B05C11/10

Abstract: An epoxy dispensing device is provided. The epoxy dispensing device includes a cylinder configured to accommodate epoxy, a lower cover configured to seal a lower portion of the cylinder, and a pin disposed under the lower cover, wherein the pin pushes up the lower cover to coat the epoxy on a lower surface of an electronic component mounted in a dispensing port formed in an upper portion of the cylinder.