公开(公告)号：US09231291B2

公开(公告)日：2016-01-05

申请号：US13932811

申请日：2013-07-01

Applicant: Electronics and Telecommunications Research Institute

Inventor： Myunghoi Kim ,  Jin Ho Jo ,  Jae Hoon Kim

IPC: H04B3/28 ,  H01P11/00 ,  H01P1/20 ,  H05K1/02

CPC classification number: H01P11/007 ,  H01P1/2005 ,  H05K1/0236 ,  H05K2201/09309 ,  Y10T29/4902

Abstract: An electromagnetic bandgap structure is provided, which includes a ground layer; a first power layer facing an upper portion of the ground layer with a dielectric interposed and comprising at least one first patch and at least one first branch; and a second power layer facing an upper portion of the first power layer with a dielectric interposed and comprising at least one second patch and at least one second branch.

Abstract translation: 提供电磁带隙结构，其包括接地层; 面向所述接地层的上部的第一电力层，其中电介质插入并且包括至少一个第一贴片和至少一个第一支路; 以及面向所述第一功率层的上部的第二功率层，具有电介质，并且包括至少一个第二贴片和至少一个第二支线。