公开(公告)号：US20180012861A1

公开(公告)日：2018-01-11

申请号：US15631678

申请日：2017-06-23

Applicant: Electronics and Telecommunications Research Institute

Inventor： Ji-Young OH ,  Joo Yeon KIM ,  Jae Bon KOO ,  Bock Soon NA ,  Nae-Man PARK ,  Chan Woo PARK ,  Sang Seok LEE ,  Soon Won JUNG ,  Chi-Sun HWANG ,  Keunsoo LEE

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L51/0097 ,  H01L51/0545 ,  H01L2224/8349 ,  H01L2924/078 ,  Y02E10/549

Abstract: Provided is a method of manufacturing an electronic apparatus which includes preparing a substrate having a first Young's modulus, disposing a thin film having a second Young's modulus greater than the first Young's modulus on the substrate, disposing an electronic device on the thin film, and disposing a capping layer configured to cover the electronic device on the thin film.