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公开(公告)号：US20230234107A1
公开(公告)日：2023-07-27
申请号：US18156399
申请日：2023-01-19
申请人： Ebara Corporation
发明人： NAOYUKI HANDA , Satomi Hamada , Tomoya Nishi
IPC分类号： B08B3/12 , B08B3/02 , B08B3/08 , B08B1/00 , B08B1/04 , B01F23/23 , B01F23/2373 , B01F23/237
CPC分类号： B08B3/12 , B08B3/02 , B08B3/08 , B08B1/001 , B08B1/04 , B01F23/238 , B01F23/2373 , B01F23/23764 , B01F23/23765 , B01F2101/58
摘要： A substrate cleaning method and a substrate cleaning apparatus are provided. The substrate cleaning method includes a first step of applying a chemical solution to a lower surface of a substrate, and a second step of subsequently applying a bubble-containing liquid to the lower surface of the substrate.
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公开(公告)号：US10229841B2
公开(公告)日：2019-03-12
申请号：US15186352
申请日：2016-06-17
申请人： EBARA CORPORATION
发明人： Masayoshi Imai , Satomi Hamada
IPC分类号： F26B5/12 , H01L21/67 , F26B21/14 , H01L21/677 , F26B5/16
摘要： A wafer drying apparatus capable of preventing formation of a watermark is disclosed. The wafer drying apparatus includes: a conveying mechanism configured to convey a wafer in a drying chamber; an inert-gas jet nozzle disposed above the conveying mechanism and configured to form a descending jet of an inert gas; and a liquid suction nozzle disposed upstream of the inert-gas jet nozzle with respect to a conveying direction of the wafer. A distance between the liquid suction nozzle and a surface of the wafer when the wafer is being conveyed by the conveying mechanism is in a range of 1 mm to 2 mm.
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公开(公告)号：US11382412B2
公开(公告)日：2022-07-12
申请号：US16648994
申请日：2018-09-20
发明人： Jin-Goo Park , Jung Hwan Lee , Satomi Hamada
摘要： A PVA brush cleaning method includes immersing a PVA brush in a cleaning solution containing an organic matter, thereby removing a siloxane compound in the PVA brush; and applying vibration to the PVA brush, thereby removing impurities in the PVA brush.
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