公开(公告)号：US20140190633A1

公开(公告)日：2014-07-10

申请号：US14043379

申请日：2013-10-01

申请人： EBARA CORPORATION

发明人： Koji Maeda ,  Hiroshi Shimomoto ,  Hisajiro Nakano ,  Masayoshi Imai ,  Yoichi Shiokawa

IPC分类号： H01L21/67

CPC分类号： H01L21/67092 ,  B24B37/04 ,  B24B37/34 ,  H01L21/67051 ,  H01L21/67219

摘要： A substrate cleaning apparatus capable of efficiently cleaning a substrate, such as a wafer, is provided. The substrate cleaning apparatus includes: a substrate holder for holding and rotating a substrate; a chemical liquid nozzle for supplying a chemical liquid onto the substrate; a two-fluid nozzle for supplying a two-fluid jet onto the substrate; and a moving mechanism for moving the chemical liquid nozzle and the two-fluid nozzle together from a center to a periphery of the substrate. The chemical liquid nozzle and the two-fluid nozzle are adjacent to each other with a predetermined distance therebetween, and the chemical liquid nozzle is located forward of the two-fluid nozzle with respect to a movement direction of the chemical liquid nozzle and the two-fluid nozzle.

摘要翻译： 提供能够有效地清洗诸如晶片的基板的基板清洗装置。 基板清洗装置包括：用于保持和旋转基板的基板保持件; 用于将化学液体供给到所述基板上的化学液体喷嘴; 用于将二流体射流供应到衬底上的双流体喷嘴; 以及用于将药液喷嘴和双流体喷嘴从基板的中心移动到周边的移动机构。 化学液体喷嘴和双流体喷嘴彼此相邻地间隔预定距离，并且化学液体喷嘴相对于化学液体喷嘴的移动方向位于双流体喷嘴的前方， 流体喷嘴。

公开(公告)号：US10985037B2

公开(公告)日：2021-04-20

申请号：US15944654

申请日：2018-04-03

申请人： EBARA CORPORATION

发明人： Daisuke Minoshima ,  Masayoshi Imai

IPC分类号： H01L21/67 ,  B08B3/02 ,  H01L21/687

摘要： Various examples regarding substrate cleaning apparatus and methods, and related apparatus and method are disclosed. According to one embodiment, provided is a substrate cleaning apparatus including: a substrate holding and rotating module; an elongated cleaning member configured to come into contact with the substrate while the substrate is held and rotated by the substrate holding and rotating module; and a first nozzle and a second nozzle, both of which are arranged on an identical side with respect to a longitudinal direction of the cleaning member, wherein the first nozzle is operably adjusted to supply liquid more forcefully than liquid from the second nozzle, and the first nozzle is arranged so that the liquid from the first nozzle is reached to a first area located closer to the first nozzle than the cleaning member in the substrate.

公开(公告)号：US10438818B2

公开(公告)日：2019-10-08

申请号：US15128309

申请日：2015-03-17

申请人： EBARA CORPORATION

发明人： Junji Kunisawa ,  Toru Maruyama ,  Masayoshi Imai ,  Koji Maeda ,  Mitsuru Miyazaki ,  Teruaki Hombo ,  Fujihiko Toyomasu

IPC分类号： H01L21/67 ,  H01L21/687 ,  B08B3/08 ,  B08B9/027 ,  H01L21/02

摘要： The present invention relates to a substrate processing apparatus for processing a substrate, such as a wafer, while supplying a cleaning liquid (e.g. pure water and a liquid chemical) to the substrate, and also relates to a pipe cleaning method for the substrate processing apparatus. The substrate processing apparatus includes: a first cleaning lane including first cleaning units (52), (54) each for cleaning a substrate while supplying pure water to the substrate; a second cleaning lane including second cleaning units (60), (62) each for cleaning a substrate while supplying pure water to the substrate; a first pure-water supply pipe (120) for supplying the pure water to the first cleaning lane; and a second pure-water supply pipe (180) for supplying the pure water to the second cleaning lane.

公开(公告)号：US10229841B2

公开(公告)日：2019-03-12

申请号：US15186352

申请日：2016-06-17

申请人： EBARA CORPORATION

发明人： Masayoshi Imai ,  Satomi Hamada

IPC分类号： F26B5/12 ,  H01L21/67 ,  F26B21/14 ,  H01L21/677 ,  F26B5/16

摘要： A wafer drying apparatus capable of preventing formation of a watermark is disclosed. The wafer drying apparatus includes: a conveying mechanism configured to convey a wafer in a drying chamber; an inert-gas jet nozzle disposed above the conveying mechanism and configured to form a descending jet of an inert gas; and a liquid suction nozzle disposed upstream of the inert-gas jet nozzle with respect to a conveying direction of the wafer. A distance between the liquid suction nozzle and a surface of the wafer when the wafer is being conveyed by the conveying mechanism is in a range of 1 mm to 2 mm.

公开(公告)号：US09666455B2

公开(公告)日：2017-05-30

申请号：US13896084

申请日：2013-05-16

申请人： Ebara Corporation

发明人： Masayoshi Imai

IPC分类号： H01L21/67 ,  H01L21/677

CPC分类号： H01L21/67034 ,  H01L21/67028 ,  H01L21/67173 ,  H01L21/6776

摘要： A substrate cleaning apparatus cleans a surface of a substrate such as a semiconductor wafer and dries the substrate. The substrate cleaning apparatus includes a process chamber having a substrate conveying unit configured to hold a substrate horizontally with its upper surface facing upwardly and to convey the substrate in one direction, and a cleaning unit configured to clean the surface of the substrate in non-contact state by supplying a cleaning liquid to the surface of the substrate which is moving in the process chamber. The substrate apparatus has an inert gas blowing unit configured to blow an inert gas toward the front and reverse surfaces of the substrate which has been cleaned in the cleaning unit to produce an inert gas atmosphere in the process chamber while drying the substrate with the inert gas.

公开(公告)号：US11848216B2

公开(公告)日：2023-12-19

申请号：US17212485

申请日：2021-03-25

申请人： Ebara Corporation

发明人： Takayuki Kajikawa ,  Takeshi Iizumi ,  Masayoshi Imai

IPC分类号： H01L21/67 ,  B08B1/04 ,  B08B13/00 ,  B08B1/00

CPC分类号： H01L21/67046 ,  B08B1/002 ,  B08B1/04 ,  B08B13/00

摘要： As an aspect of the present invention, a cleaning apparatus for cleaning member has a holding part holding a cleaning member assembly having a cleaning member; an inner cleaning liquid supply part; an outer cleaning liquid supply part; and a control part controlling the substrate cleaning apparatus to perform a first process in which the cleaning member is pressed against a dummy substrate at a first pressure and the outer cleaning liquid supply part supplies the cleaning liquid to the dummy substrate, and to perform a second process in which the cleaning member is separated from the dummy substrate or is pressed against the dummy substrate at a second pressure which is equal to or less than the first pressure and the inner cleaning liquid supply part supplies the cleaning liquid.

公开(公告)号：US11495475B2

公开(公告)日：2022-11-08

申请号：US16780049

申请日：2020-02-03

申请人： EBARA CORPORATION

发明人： Koji Maeda ,  Hiroshi Shimomoto ,  Hisajiro Nakano ,  Masayoshi Imai ,  Yoichi Shiokawa

IPC分类号： H01L21/302 ,  H01L21/67 ,  B24B37/34 ,  B24B37/04

摘要： Various methods of cleaning a substrate are provided. In one aspect, method of cleaning a substrate, comprising: holding and rotating a substrate by a substrate holder; and supplying a chemical liquid to a chemical liquid nozzle and supplying two fluids to a two-fluid nozzle while moving the chemical-liquid nozzle and the two-fluid nozzle radially outwardly from the center to the periphery of the substrate, wherein the distance of the chemical-liquid nozzle from a rotating axis of the substrate holder is longer than the distance of the two-fluid nozzle from the rotating axis of the substrate holder while the chemical-liquid nozzle and the two-fluid nozzle are moved radially outwardly from the rotating axis of the substrate holder.

公开(公告)号：US10607862B2

公开(公告)日：2020-03-31

申请号：US15605533

申请日：2017-05-25

申请人： EBARA CORPORATION

发明人： Masayoshi Imai

IPC分类号： H01L21/67 ,  H01L21/677

摘要： A substrate cleaning apparatus cleans a surface of a substrate such as a semiconductor wafer and dries the substrate. The substrate cleaning apparatus includes a process chamber having a substrate conveying unit configured to hold a substrate horizontally with its upper surface facing upwardly and to convey the substrate in one direction, and a cleaning unit configured to clean the surface of the substrate in non-contact state by supplying a cleaning liquid to the surface of the substrate which is moving in the process chamber. The substrate apparatus has an inert gas blowing unit configured to blow an inert gas toward the front and reverse surfaces of the substrate which has been cleaned in the cleaning unit to produce an inert gas atmosphere in the process chamber while drying the substrate with the inert gas.

公开(公告)号：US20130306116A1

公开(公告)日：2013-11-21

申请号：US13896084

申请日：2013-05-16

申请人： Ebara Corporation

发明人： Masayoshi Imai

IPC分类号： H01L21/67

CPC分类号： H01L21/67034 ,  H01L21/67028 ,  H01L21/67173 ,  H01L21/6776

摘要： A substrate cleaning apparatus cleans a surface of a substrate such as a semiconductor wafer and dries the substrate. The substrate cleaning apparatus includes a process chamber having a substrate conveying unit configured to hold a substrate horizontally with its upper surface facing upwardly and to convey the substrate in one direction, and a cleaning unit configured to clean the surface of the substrate in non-contact state by supplying a cleaning liquid to the surface of the substrate which is moving in the process chamber. The substrate apparatus has an inert gas blowing unit configured to blow an inert gas toward the front and reverse surfaces of the substrate which has been cleaned in the cleaning unit to produce an inert gas atmosphere in the process chamber while drying the substrate with the inert gas.

摘要翻译： 基板清洗装置清洗半导体晶片等基板的表面，干燥基板。 基板清洗装置包括处理室，该处理室具有基板输送单元，该基板输送单元被配置为水平地保持基板，其上表面面向上并沿一个方向输送基板;以及清洁单元，其构造成以非接触方式清洁基板的表面 通过向在处理室中移动的基板的表面供给清洗液。 基板装置具有惰性气体吹送单元，该单元被配置为向清洁单元中已清洁的基板的前表面和反面喷射惰性气体，以在处理室中产生惰性气体气氛，同时用惰性气体干燥基板 。