公开(公告)号：US20150237739A1

公开(公告)日：2015-08-20

申请号：US14704597

申请日：2015-05-05

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Yong Sung EOM ,  Kwang-Seong CHOI ,  Hyun-cheol BAE ,  Jung Hyun NOH ,  Jong Tae MOON

IPC: H05K3/12 ,  H05K3/10 ,  H05K3/18 ,  H05K1/09

CPC classification number: H05K3/1216 ,  C25D5/02 ,  H01B1/02 ,  H01B1/22 ,  H05K1/09 ,  H05K1/095 ,  H05K3/102 ,  H05K3/188 ,  H05K3/246 ,  H05K2201/0245 ,  H05K2201/0302 ,  H05K2203/0425

Abstract: The present invention relates to a pattern-forming composition used to form a conductive circuit pattern. The pattern-forming composition comprises Cu powders, a solder for electrically coupling the Cu powders, a polymer resin, a curing agent and a reductant. According to the present invention, a circuit pattern having superior conductivity can be formed at low cost.

Abstract translation: 本发明涉及用于形成导电电路图案的图案形成组合物。 图案形成组合物包括Cu粉末，用于电耦合Cu粉末的焊料，聚合物树脂，固化剂和还原剂。 根据本发明，可以以低成本形成具有优良导电性的电路图案。