公开(公告)号：US10032655B2

公开(公告)日：2018-07-24

申请号：US14334394

申请日：2014-07-17

申请人： EBARA CORPORATION

发明人： Takeshi Sakurai ,  Eiji Hirai ,  Kaoru Hamaura ,  Mitsuru Miyazaki ,  Koji Maruyama

IPC分类号： H01L21/67 ,  B08B1/00

摘要： A substrate cleaning device 1 includes a substrate holding unit 10 configured to hold a substrate W, a first cleaning unit 11 having a first cleaning member 11a caused to come into contact with a first surface WA of the substrate W held by the substrate holding unit 10 to clean the first surface WA, a second cleaning unit 12 having a second cleaning member 12a caused to come into contact with the first surface WA of the substrate W held by the substrate holding unit 10 to clean the first surface WA, and a controller 50 configured to control the first and second cleaning units 11, 12 so that, when any one of the first cleaning member 11a and the second cleaning member 12a cleans the first surface WA of the substrate W held by the substrate holding unit 10, the other cleaning member is at a position apart from the substrate W held by the substrate holding unit 10.

公开(公告)号：US20150118944A1

公开(公告)日：2015-04-30

申请号：US14372446

申请日：2014-01-29

申请人： EBARA CORPORATION

发明人： Ryuichi Kosuge ,  Tadakazu Sone ,  Soichi Isobe ,  Takeshi Sakurai ,  Eiji Hirai ,  Kaoru Hamaura ,  Suguru Ogura

IPC分类号： B24B37/34 ,  B24B45/00 ,  B24B37/04

CPC分类号： B24B37/34 ,  B24B37/04 ,  B24B45/006 ,  Y10T29/4973 ,  Y10T29/49826

摘要： The work of replacing a polishing pad is easily performed, and thermal damage is prevented from occurring in a polishing table. A polishing apparatus 100 includes a polishing table 110 having an attachment surface 110a to which a polishing pad 108 used to polish a substrate 102 is attached. The polishing apparatus 100 also includes a silicone layer 111 provided on the attachment surface 110a of the polishing table 110 and interposed between the polishing table 110 and the polishing pad 108. By interposing the silicone layer 111, it is possible to easily detach and attach the polishing pad 108. In addition, since a heat treatment for coating the silicone layer 111 on the polishing table 110 is performed at a relatively low temperature, it is possible to prevent thermal damage from occurring in the polishing table 110 due to the heat treatment.

摘要翻译： 更换抛光垫的工作容易进行，并且防止在抛光台中发生热损伤。 抛光装置100包括具有安装表面110a的抛光台110，用于抛光衬底102的抛光垫108被附接到该附接表面110a。 抛光装置100还包括设置在研磨台110的附接表面110a上并插入在抛光台110和抛光垫108之间的硅树脂层111.通过插入硅树脂层111，可以容易地分离和附着 另外，由于在相对较低的温度下进行用于涂覆在研磨台110上的硅氧烷层111的热处理，因此可以防止由于热处理而在研磨台110中发生热损伤。

公开(公告)号：US20150020851A1

公开(公告)日：2015-01-22

申请号：US14334394

申请日：2014-07-17

申请人： EBARA CORPORATION

发明人： Takeshi Sakurai ,  Eiji Hirai ,  Kaoru Hamaura ,  Mitsuru Miyazaki ,  Koji Maruyama

IPC分类号： H01L21/67

CPC分类号： H01L21/67046 ,  B08B1/007 ,  H01L21/67051

摘要： A substrate cleaning device 1 includes a substrate holding unit 10 configured to hold a substrate W, a first cleaning unit 11 having a first cleaning member 11a caused to come into contact with a first surface WA of the substrate W held by the substrate holding unit 10 to clean the first surface WA, a second cleaning unit 12 having a second cleaning member 12a caused to come into contact with the first surface WA of the substrate W held by the substrate holding unit 10 to clean the first surface WA, and a controller 50 configured to control the first and second cleaning units 11, 12 so that, when any one of the first cleaning member 11a and the second cleaning member 12a cleans the first surface WA of the substrate W held by the substrate holding unit 10, the other cleaning member is at a position apart from the substrate W held by the substrate holding unit 10.

摘要翻译： 基板清洗装置1包括：基板保持单元10，被配置为保持基板W;第一清洁单元11，具有第一清洁构件11a，使其与基板保持单元10保持的基板W的第一表面WA接触 以清洁第一表面WA，具有第二清洁部件12a的第二清洁单元12与由基板保持单元10保持的基板W的第一表面WA接触以清洁第一表面WA，以及控制器50 被配置为控制第一和第二清洁单元11,12，使得当第一清洁构件11a和第二清洁构件12a中的任何一个清洁由基板保持单元10保持的基板W的第一表面WA时，另一个清洁 构件处于与由基板保持单元10保持的基板W分开的位置。