MEASUREMENT APPARATUS AND METHOD THEREOF
    1.
    发明申请
    MEASUREMENT APPARATUS AND METHOD THEREOF 有权
    测量装置及其方法

    公开(公告)号:US20100260583A1

    公开(公告)日:2010-10-14

    申请号:US12609141

    申请日:2009-10-30

    IPC分类号: B65H1/00

    CPC分类号: G01B5/02 B07C5/10 G01B5/20

    摘要: A measurement apparatus includes a support frame to support a feed mechanism, an orientation mechanism, a measurement mechanism, a transfer mechanism, and an unloading mechanism. The feed mechanism includes a first holding assembly, a first elevation assembly, a second elevation assembly, and a first clipping assembly. The first elevation assembly and the second elevation assembly are positioned under the holding assembly, and the first clipping assembly is positioned over the holding assembly. The measurement mechanism includes a support stage and at least one calibration head. The transfer mechanism includes at least one pickup head. The orientation mechanism includes a driving member and a securing assembly driven by the driving member. The unloading mechanism has the same structure as the feed mechanism. The disclosure further provides a measuring method using the measurement apparatus.

    摘要翻译: 测量装置包括支撑进给机构的支撑框架,定向机构,测量机构,传送机构和卸载机构。 进给机构包括第一保持组件,第一升高组件,第二升降组件和第一夹紧组件。 第一升降组件和第二升降组件定位在保持组件下方,并且第一夹紧组件定位在保持组件上方。 测量机构包括支撑台和至少一个校准头。 传送机构包括至少一个拾取头。 定位机构包括驱动构件和由驱动构件驱动的固定组件。 卸载机构具有与进给机构相同的结构。 本公开还提供了使用该测量装置的测量方法。

    VACUUM DEVICE AND BONDING APPARATUS USING THE SAME
    2.
    发明申请
    VACUUM DEVICE AND BONDING APPARATUS USING THE SAME 有权
    真空装置和使用该装置的连接装置

    公开(公告)号:US20110021105A1

    公开(公告)日:2011-01-27

    申请号:US12567907

    申请日:2009-09-28

    IPC分类号: H01J9/38

    摘要: A vacuum device includes a main body and an adjustment assembly connected to the main body. The main body includes a frame, a loading member, and an elastic film. The loading member and the elastic film are arranged at opposite end surfaces of the frame. A chamber is cooperatively formed by the frame, the loading member, and the elastic film. The adjustment assembly adjusts the inner air pressure of the chamber. The loading member includes an absorption area connecting the chamber to outside the main body. The absorption area changes the air pressure inside the chamber. Also provided is a bonding apparatus using the vacuum device.

    摘要翻译: 真空装置包括主体和连接到主体的调节组件。 主体包括框架,装载构件和弹性膜。 装载构件和弹性膜布置在框架的相对端表面处。 由框架,装载构件和弹性膜协同地形成腔室。 调节组件调节室的内部空气压力。 装载构件包括将腔室连接到主体外部的吸收区域。 吸收面积改变室内的空气压力。 还提供了使用真空装置的接合装置。

    BONDING APPARATUS
    3.
    发明申请
    BONDING APPARATUS 有权
    绑定装置

    公开(公告)号:US20110017405A1

    公开(公告)日:2011-01-27

    申请号:US12567910

    申请日:2009-09-28

    IPC分类号: B32B37/10

    摘要: A bonding apparatus for bonding a first substrate and a second substrate includes a base body, a first stripping device, a second stripping device, at least two vacuum bonding devices, and a loading mechanism. The first stripping device removes a film from the first substrate, and the second stripping device removes a film from the second substrate. The at least two vacuum bonding devices are arranged on the base body and aligned with each other. The loading mechanism includes a slide-rail on the base body and an adjustment assembly slidably connected to the slide-rail. The loading mechanism transfers a first substrate and a second substrate into one vacuum bonding device, and then, sliding on the slider, transfers another first substrate and another second substrate to another vacuum bonding device.

    摘要翻译: 用于接合第一基板和第二基板的接合装置包括基体,第一剥离装置,第二剥离装置,至少两个真空接合装置和装载机构。 第一剥离装置从第一基底去除膜,第二剥离装置从第二基底去除膜。 至少两个真空接合装置设置在基体上并彼此对准。 装载机构包括在基体上的滑轨和可滑动地连接到滑轨的调节组件。 装载机构将第一基板和第二基板传送到一个真空接合装置中,然后在滑块上滑动将另一个第一基板和另一个第二基板传递到另一个真空接合装置。