HEAT DISSIPATION HOUSING FOR AC POWER ADAPTER

    公开(公告)号:US20230345679A1

    公开(公告)日:2023-10-26

    申请号:US18166494

    申请日:2023-02-09

    CPC classification number: H05K7/209

    Abstract: The present disclosure provides a heat dissipation housing for an AC power adapter, including a housing and a heat sink disposed on an inner surface of the housing, and integrally formed with the housing. The heat sink includes an upper surface which is in close contact with the housing, and a lower surface which is exposed to the inside of the heat sink housing. The heat sink includes at least one securing structure which is formed by the upper surface of the heat sink.

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