HEAT EXCHANGE DEVICE
    1.
    发明申请

    公开(公告)号:US20170184353A1

    公开(公告)日:2017-06-29

    申请号:US15168969

    申请日:2016-05-31

    IPC分类号: F28F13/06 F28D9/00

    摘要: A heat exchange device includes a housing, a heat exchange module, and a piezoelectric module. Isolated inner and outer circulation chambers are formed in the housing. The heat exchange module in the housing includes a stack of separated plates parallel to each other. An inner channel communicated with the inner circulation chamber and an outer channel communicated with the outer circulation chamber are defined respectively by both sides of one of the plates and the other adjacent plates. The piezoelectric module in the housing includes a piezoelectric chip, and first and second heat exchange sides thermally coupled to the piezoelectric chip. The first heat exchange side is located in the inner circulation chamber and the second heat exchange side is located in the outer circulation chamber, so that heat can be transferred between the inner and outer circulation chambers via the piezoelectric chip.

    HEATING APPARATUS WITH AUTOMATIC SWITCHING HEATERS AND METHOD OF OPERATING THE SAME

    公开(公告)号:US20180227985A1

    公开(公告)日:2018-08-09

    申请号:US15830857

    申请日:2017-12-04

    IPC分类号: H05B1/02

    CPC分类号: H05B1/02 H05B1/023

    摘要: A heating apparatus with automatic switching heaters includes a control module, a switch module, and a heating module. The control module receives an input power source. The switch module is connected to the control module. The heating module is connected to the switch module. When the control module detects that an amplitude of the input power source is larger than a threshold voltage value, the control module turns on a first switch assembly and turns off a second switch assembly of the switch module so that the heating module operates in a first heating mode. When the control module detects that the amplitude of the input power source is less than the threshold voltage value, the control module turns on the first switch assembly and the second switch assembly of the switch module so that the heating module operates in a second heating mode.

    THERMOELECTRIC COOLING MODULE
    4.
    发明申请

    公开(公告)号:US20170223817A1

    公开(公告)日:2017-08-03

    申请号:US15074558

    申请日:2016-03-18

    IPC分类号: H05K1/02 H05K1/14 H05K1/11

    摘要: A thermoelectric cooling module includes a first circuit board, a second circuit board, first conducting members, second conducting members and TED chips. The first circuit board includes first circuit regions, each having a first conducting layer and first penetrating holes; the second circuit board includes second circuit regions, each having a second conducting layer and second penetrating holes; each first conducting member is passed and fixed into each respective first penetrating hole; each second conducting member is passed and fixed into each respective second penetrating hole; each TED chip is clamped between the first circuit board and the second circuit board, and each first conducting member has an end attached to the TED chip and the other end attached to the first conducting layer, and each second conducting member has an end attached to the TED chip and the other end attached to the second conducting layer.