知搜-全球专利检索

  1. 登录
  2. 注册

搜索结果

27 条记录 (耗时 0.016 秒)

    EDGE-TO-EDGE DISPLAY WITH A SENSOR REGION
    2.
    发明申请
    EDGE-TO-EDGE DISPLAY WITH A SENSOR REGION 有权

    公开(公告)号：US20230008336A1

    公开(公告)日：2023-01-12

    申请号：US17369639

    申请日：2021-07-07

    申请人： Dell Products L.P.

    发明人： Mark A. Schwager ,  Laurent Andrew Regimbal ,  HongJi Huang

    IPC分类号： G02F1/1362 ,  G02F1/1339 ,  G02F1/1335 ,  G02F1/1333 ,  G02F1/1345 ,  G06F3/01 ,  G06F1/16

    摘要： A portable information handling system housing integrates a display having an edge-to-edge presentation of visual images at a housing portion with an inactive portion of a display panel along a perimeter of the display having a sensor region that provides access to underlying sensors through the display. A sealant and black matrix disposed in the inactive region limits illumination that escapes from an active region and provides an aesthetically appealing edge-to-edge appearance. Openings in the sealant and black matrix at the sensor locations provides access through the display, such as with index matching resin that passes illumination and a patterned covering of the black matrix.

    INFORMATION HANDLING SYSTEM THERMALLY CONDUCTIVE HINGE
    7.
    发明申请
    INFORMATION HANDLING SYSTEM THERMALLY CONDUCTIVE HINGE 审中-公开

    公开(公告)号：US20190317574A1

    公开(公告)日：2019-10-17

    申请号：US15952519

    申请日：2018-04-13

    申请人： Dell Products L.P.

    发明人： Travis C. North ,  Mark A. Schwager ,  Austin M. Shelnutt ,  John T. Morrison

    IPC分类号： G06F1/20 ,  G06F1/16

    摘要： A portable information handling system transfers thermal energy associated with operation of a CPU from a main housing portion to a lid housing portion with thermal conduction through a hinge assembly that rotationally couples the main and lid housing portions to each other. For example, thermal conduits insert into a hinge body and transfer thermal energy across the hinge body through a thermally conductive interface, such as the hinge body itself, thermal grease disposed in the hinge body, a liquid that fills a cavity of the hinge body shared by the thermal conduits, and a vapor chamber integrated in the hinge body.

    Information handling system dynamic thermal transfer control
    9.
    发明授权
    Information handling system dynamic thermal transfer control 有权

    公开(公告)号：US10936031B2

    公开(公告)日：2021-03-02

    申请号：US15952536

    申请日：2018-04-13

    申请人： Dell Products L.P.

    发明人： Travis C. North ,  Mark A. Schwager ,  Austin M. Shelnutt ,  John T. Morrison

    IPC分类号： G06F1/20 ,  H05K7/20 ,  G06F1/18

    摘要： A portable information handling system transfers thermal energy associated with operation of a CPU to a location distal the CPU with a vapor chamber thermally interfaced with the CPU. A pressure adapter interfaced with the vapor chamber selectively changes the pressure within the vapor chamber to adjust the saturation point of a liquid in the vapor chamber that manages thermal transfer efficiency. For example, a controller interfaced with the pressure adapter modifies thermal transfer characteristics of the vapor chamber to control thermal conditions at the information handling system, such as in response to a temperature sensed at a housing surface, a battery, a display or at other locations of the information handling system.

    Information handling system thermally conductive hinge
    10.
    发明授权
    Information handling system thermally conductive hinge 有权

    公开(公告)号：US10802555B2

    公开(公告)日：2020-10-13

    申请号：US15952519

    申请日：2018-04-13

    申请人： Dell Products L.P.

    发明人： Travis C. North ,  Mark A. Schwager ,  Austin M. Shelnutt ,  John T. Morrison

    IPC分类号： G06F1/20 ,  G06F1/16 ,  H01L23/427 ,  H05K7/20

    摘要： A portable information handling system transfers thermal energy associated with operation of a CPU from a main housing portion to a lid housing portion with thermal conduction through a hinge assembly that rotationally couples the main and lid housing portions to each other. For example, thermal conduits insert into a hinge body and transfer thermal energy across the hinge body through a thermally conductive interface, such as the hinge body itself, thermal grease disposed in the hinge body, a liquid that fills a cavity of the hinge body shared by the thermal conduits, and a vapor chamber integrated in the hinge body.