Abstract:
Embodiments of apparatuses, systems and methods related to Solid State Drive (SSD) cooling in dense storage are described. An embodiment of an apparatus may include a housing. The apparatus may also include a first set of peripheral heatsink fins disposed parallel to a first axis of the housing. Additionally, the apparatus may include a second set of peripheral heatsink fins disposed parallel to a second axis of the housing. Also, the apparatus may include a set of heatsink members disposed adjacent the first set of peripheral heatsink fins and the second set of peripheral heatsink fins, the set of heat sink members configured to align with at least one of the first set of peripheral heatsink fins and the second set of peripheral heatsink fins.
Abstract:
A method of manufacturing a chassis that cools thermal energy generating components of an information handling system (IHS) includes: forming an enclosure with a chassis that has a base wall for provisioning a thermal energy generating component; forming one or more stiffeners each having one or more air channels formed transversely through for directing air proximate to the base wall; attaching the one or more stiffeners laterally across the base wall; and attaching a planar member that is horizontally on top of the one or more stiffeners for engaging one or more forward compute components on top of the planar member that substantially block air flow above the planar member to the thermal energy generating component. The one or more air channels eliminate thermal shadowing caused by thermal energy generating components provisioned in a rear area of the chassis.
Abstract:
A component carrier may include a carrier front wall and a plurality of carrier side walls extending in a substantially parallel orientation to each other from opposite edges of the chassis front wall, and defining a component channel between them. The carrier side walls may include respective guide flanges extending substantially perpendicularly therefrom such that the guide flanges are in a substantially parallel orientation to each other and the guide flanges are oriented relative to the remainder of the component carrier such that when a component is mounted within the component channel to the component carrier, and the guide flanges may define a plane whereby a combined mass on a first side of the plane of the component carrier and the component is approximately equal to a combined mass on a second side of the component carrier and the component.
Abstract:
A drive assembly comprising a drive and a drive carrier. The drive carrier includes an active bar which comprises a plurality of drive holders and an engagement mechanism. The active bar of a drive assembly performs a plurality of drive assembly functions.
Abstract:
In accordance with embodiments of the present disclosure, an information handling system may include a processor and a storage resource communicatively coupled to the processor. The storage resource may be configured to monitor one or more operating parameters of the storage resource indicative of vibration external to the storage resource affecting performance of the storage resource, determine whether the one or more operating parameters exceed respective threshold values, and in response to determining that the one or more operating parameters exceed a respective threshold value, communicate an indication from the storage resource to a subsystem of the information handling system that the storage resource is experiencing excessive vibration from sources external to the storage resource.
Abstract:
A component carrier may include a carrier front wall and a plurality of carrier side walls extending in a substantially parallel orientation to each other from opposite edges of the chassis front wall, and defining a component channel between them. The carrier side walls may include respective guide flanges extending substantially perpendicularly therefrom such that the guide flanges are in a substantially parallel orientation to each other and the guide flanges are oriented relative to the remainder of the component carrier such that when a component is mounted within the component channel to the component carrier, and the guide flanges may define a plane whereby a combined mass on a first side of the plane of the component carrier and the component is approximately equal to a combined mass on a second side of the component carrier and the component.
Abstract:
Systems and methods are provided for throughput optimization of a hard disk drive (HDD) using position error signaling (PES) that includes determining a PES for a HDD mounted in a chassis based on a dynamic disturbance. The method also includes calculating a critical parameter of the PES. The method further includes indicating a mechanical design modification of the HDD or the chassis if the critical parameter of the PES exceeds a pre-defined threshold.
Abstract:
A connector for electrically coupling an information handling resource to a backplane, may include a lead frame comprising a plurality of electrically-conductive traces configured to be electrically coupled to the backplane and a receptacle having a plurality of electrically-conductive pins each electrically coupled to a corresponding one of the plurality of electrically-conductive traces of the lead frame, configured to mechanically and electrically couple the respective modular information handling resource to the receptacle, and structurally oriented relative to the electrically-conductive traces of the lead frame and the backplane such that insertion and removal of the respective modular information handling resource to or from the receptacle is caused by applying force to the respective modular information handling resource in a direction substantially parallel to a surface of the backplane having a surface area substantially larger than that of at least all but one of other surfaces of the backplane.
Abstract:
A chassis directs cooling air around compute components of an information handling system (IHS). The chassis includes an enclosure having a base wall, an air intake at a front side, and an air exhaust at a rear side. Stiffeners are attached laterally across the base wall and positioned between the front side and a rear area of the base wall. A planar member is horizontally attached on top of the one or more stiffeners. The planar member is provisioned with the compute components, which substantially block air flow above the planar member causing thermal shadowing of the thermal energy generating component that is provisioned in the rear area. Air channels formed through each of the stiffeners direct air flow under the planar member toward the rear area that is provisioned with the thermal energy generating component.
Abstract:
Embodiments of apparatuses, systems and methods related to Solid State Drive (SSD) cooling in dense storage are described. An embodiment of an apparatus may include a housing. The apparatus may also include a first set of peripheral heatsink fins disposed parallel to a first axis of the housing. Additionally, the apparatus may include a second set of peripheral heatsink fins disposed parallel to a second axis of the housing. Also, the apparatus may include a set of heatsink members disposed adjacent the first set of peripheral heatsink fins and the second set of peripheral heatsink fins, the set of heat sink members configured to align with at least one of the first set of peripheral heatsink fins and the second set of peripheral heatsink fins.