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公开(公告)号:US20120048255A1
公开(公告)日:2012-03-01
申请号:US13318176
申请日:2010-05-03
CPC分类号: B23D57/0023 , B23D57/0038 , B23D57/0053 , B23D57/0061 , B28D5/045 , Y10T29/4973
摘要: In a wire saw that serves for cutting polygonal, columnar bricks out of an ingot of a generally inorganic crystalline material, more particularly a semiconductor material, a cutting yoke (5) having at least two angularly offset saw wire fields is provided that is displaceable in the saw feed direction (7). The yoke is coupled to a carrier (38) by means of an assembly of two rails (40, 42). In this manner, the yoke (5) is easily removable from the process chamber (1) of the wire saw by pulling one rail (42) out of the other rail (40) in order to perform maintenance operations etc. The saw wire in the cutting yoke (5) is guided in an essentially meander-shaped path so that the cutting wire essentially only extends in the wire fields (sections 14, 16) and on the sides of the frame (20) of the cutting yoke (5).
摘要翻译: 在用于切割通常为无机结晶材料的锭的多边形柱状砖的线锯中,更具体地说是半导体材料,提供了具有至少两个角偏移锯线场的切割轭(5),其可以在 锯进给方向(7)。 轭通过两个轨道(40,42)的组件联接到载体(38)。 以这种方式,通过将一个导轨(42)从另一个导轨(40)拉出以便进行维护操作等,通过将线架(5)容易地从线锯的处理室(1)移除。 切割轭(5)基本上是曲折形状的路径被引导,使得切割线基本上仅在切割轭(5)的框架(20)的线区域(部分14,16)和侧面上延伸, 。