公开(公告)号：US20130070102A1

公开(公告)日：2013-03-21

申请号：US13622304

申请日：2012-09-18

Applicant: DRS RSTA, INC.

Inventor： Eric J. Gustafson ,  Glen Francisco ,  Adam J. Ward

IPC: H04N5/33

CPC classification number: H04N5/33 ,  G01J5/043 ,  G01J2005/063 ,  H04N5/2251

Abstract: A thermal imaging system includes a mounting structure characterized by a first thermal conductivity and a focal plane array mounted to the mounting structure. The thermal imaging system also includes an optical system coupled to the mounting structure and a heating element coupled to the mounting structure. The thermal imaging system further includes a thermal isolator coupled to the mounting structure and characterized by a second thermal conductivity lower than the first thermal conductivity.

Abstract translation: 热成像系统包括安装结构，其特征在于第一导热系数和安装在安装结构上的焦平面阵列。 热成像系统还包括耦合到安装结构的光学系统和耦合到安装结构的加热元件。 热成像系统还包括耦合到安装结构的热隔离器，其特征在于低于第一热导率的第二热导率。

公开(公告)号：US09386239B2

公开(公告)日：2016-07-05

申请号：US13622304

申请日：2012-09-18

Applicant: DRS RSTA, INC.

Inventor： Eric J. Gustafson ,  Glen Francisco ,  Adam J. Ward

IPC: H04N5/33 ,  G01J5/04 ,  H04N5/225 ,  G01J5/06

CPC classification number: H04N5/33 ,  G01J5/043 ,  G01J2005/063 ,  H04N5/2251

Abstract: A thermal imaging system includes a mounting structure characterized by a first thermal conductivity and a focal plane array mounted to the mounting structure. The thermal imaging system also includes an optical system coupled to the mounting structure and a heating element coupled to the mounting structure. The thermal imaging system further includes a thermal isolator coupled to the mounting structure and characterized by a second thermal conductivity lower than the first thermal conductivity.

Abstract translation: 热成像系统包括安装结构，其特征在于第一导热系数和安装在安装结构上的焦平面阵列。 热成像系统还包括耦合到安装结构的光学系统和耦合到安装结构的加热元件。 热成像系统还包括耦合到安装结构的热隔离器，其特征在于低于第一热导率的第二热导率。