公开(公告)号：US10960642B2

公开(公告)日：2021-03-30

申请号：US15903825

申请日：2018-02-23

Applicant: DIC Corporation

Inventor： Shinichi Ohara ,  Kiyokazu Umetsu ,  Ryoji Kimura ,  Tomoo Okubo ,  Kenichi Shimamura ,  Kohei Nakane

IPC: C09J175/04 ,  B32B7/12 ,  B32B9/00 ,  B32B15/20 ,  C08G18/62 ,  C08G18/76 ,  C08G18/42 ,  C08G18/40 ,  C09J125/02 ,  C09J135/06 ,  B32B27/40 ,  B32B15/095

Abstract: Provided is a solvent-free-adhesive polyisocyanate composition, containing, a polyisocyanate (A) and an aromatic vinyl-maleic anhydride copolymer (B), which is a copolymer of aromatic vinyl and maleic anhydride in which a molar ratio [aromatic vinyl/maleic anhydride] of the raw material monomers of the copolymer is 1.5/1 to 5/1. Further provided is a method for producing the polyisocyanate composition; a solvent-free adhesive containing, the solvent-free-adhesive polyisocyanate composition and a polyol (Y); and a multilayer film obtained by laminating a first base material film, a second base material film, and an adhesive layer between the base material films, in which the adhesive layer is formed of the solvent-free adhesive.

公开(公告)号：US20190169475A1

公开(公告)日：2019-06-06

申请号：US15903825

申请日：2018-02-23

Applicant: DIC Corporation

Inventor： Shinichi Ohara ,  Kiyokazu Umetsu ,  Ryoji Kimura ,  Tomoo Okubo ,  Kenichi Shimamura ,  Kohei Nakane

IPC: C09J175/04 ,  B32B7/12 ,  B32B9/00 ,  B32B15/20 ,  C08G18/62 ,  C08G18/76 ,  C08G18/42 ,  C08G18/40

Abstract: Provided is a solvent-free-adhesive polyisocyanate composition, containing, a polyisocyanate (A) and an aromatic vinyl-maleic anhydride copolymer (B), which is a copolymer of aromatic vinyl and maleic anhydride in which a molar ratio [aromatic vinyl/maleic anhydride] of the raw material monomers of the copolymer is 1.5/1 to 5/1. Further provided is a method for producing the polyisocyanate composition; a solvent-free adhesive containing, the solvent-free-adhesive polyisocyanate composition and a polyol (Y); and a multilayer film obtained by laminating a first base material film, a second base material film, and an adhesive layer between the base material films, in which the adhesive layer is formed of the solvent-free adhesive.