公开(公告)号：US20020110178A1

公开(公告)日：2002-08-15

申请号：US10125946

申请日：2002-04-19

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： Christopher M. Puranen ,  Ronald P. Jones ,  Phillip B. Sprecher

IPC: G01J005/02 ,  G01K001/14 ,  G01K013/00

CPC classification number: G01J5/02 ,  G01J5/0205 ,  G01J5/026 ,  G01J5/04 ,  G01J5/16 ,  G01J2005/068 ,  H05K1/0201 ,  H05K1/148 ,  H05K3/0052 ,  H05K3/36

Abstract: In one aspect of the invention, a temperature sensing system, including: control components; and an infrared sensor to provide a temperature input signal to the control components, the infrared sensor being located remotely from the control components. In an additional aspect of the invention, a circuit board for an infrared temperature sensing system, including: a first portion; a second portion coplanar with the first portion; and at least one necked down portion joining the first portion and the second portion. In a further aspect of the invention, a housing for an infrared temperature sensing system, including: a base member; and first support members attached to the base member to permit an infrared temperature sensor to be mounted in a selected one of two positions.

Abstract translation: 在本发明的一个方面，一种温度感测系统，包括：控制部件; 以及红外传感器，用于向控制部件提供温度输入信号，红外传感器远离控制部件。 在本发明的另一方面，一种用于红外温度感测系统的电路板，包括：第一部分; 第二部分与第一部分共面; 以及连接第一部分和第二部分的至少一个颈缩部分。 在本发明的另一方面，一种用于红外温度感测系统的壳体，包括：基座构件; 以及附接到所述基座构件的第一支撑构件，以允许将红外温度传感器安装在两个位置中选定的一个位置。