公开(公告)号：US20040149908A1

公开(公告)日：2004-08-05

申请号：US10248602

申请日：2003-01-31

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： Javier Ruiz

IPC: G01J005/04

CPC classification number: G01J5/04 ,  G01J5/045

Abstract: A hermetic package of a type used to contain a sensing element, such as an infrared sensing element. The package comprises a base having a base wall and sidewalls surrounding the base wall to define a first recess within the base. The sensing element is fabricated on a device chip disposed within the first recess. A lid is hermetically sealed with the base to enclose the sensing element. The lid defines a second recess that communicates with the first recess, such that the first and second recesses define a continuous cavity between the lid and the base and in which the device chip is contained. The depth of the second recess is preferably at least about half the depth of the sensing element within the first recess, such that neither the lid nor the base are required to have a deep recess that defines essentially the entire cavity in which the device chip is contained.

Abstract translation: 用于容纳诸如红外感测元件的感测元件的类型的气密封装。 该包装包括具有底壁和围绕底壁的侧壁的底座，以限定底座内的第一凹槽。 感测元件制造在设置在第一凹部内的器件芯片上。 盖子与基座密封以封闭传感元件。 盖子限定了与第一凹部连通的第二凹部，使得第一和第二凹部在盖子和基座之间限定连续的空腔，并且装置芯片被容纳在其中。 第二凹槽的深度优选地是第一凹槽内的感测元件的深度的至少约一半，使得盖子和底座都不需要具有基本上限定整个空腔的深凹部，其中装置芯片是 包含