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公开(公告)号：US20240006113A1
公开(公告)日：2024-01-04
申请号：US18205564
申请日：2023-06-04
发明人： Zuei-Chown Jou , Chih-Ho Liu , Jui-Wen Kuo , Chi-Ming Huang , Bo-Yu Huang , Yao-Tsung Chen
CPC分类号： H01F27/2828 , H01F27/292 , H01F27/327 , H01F41/10 , H01F41/0246
摘要： An inductor includes a coil, a conductive lead frame, and a housing. The coil includes a coil body and a lead protruding from the coil body. The lead has a U-bend portion. The lead is electrically fixed onto the conductive lead frame. The housing encapsulates the coil and exposes the conductive lead frame. A method of manufacturing an inductor includes the following steps: providing a coil, providing a conductive lead frame, making a lead of the coil be electrically fixed onto the conductive lead frame, bending the lead to form a U-bend portion and make the main body of the coil close to a portion of the lead that connects with the conductive lead frame, and forming a housing to encapsulate the coil and expose the conductive lead frame.
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公开(公告)号：US20230395320A1
公开(公告)日：2023-12-07
申请号：US18203055
申请日：2023-05-29
发明人： Chih-Ho Liu , Jui-Wen Kuo , Chi-Ming Huang , Bo-Yu Huang , Yao-Tsung Chen
摘要： An integrated-type coupled inductor is applied to a related manufacturing method and includes a lead frame, a first coil, a second coil and a magnetic packing component. The lead frame has a first surface and a second surface opposite to each other and includes four pins. The first coil is disposed on the first surface and coupled to two of the four pins. The second coil is disposed on the second surface and coupled to other pins. The magnetic packing component covers the first coil and the second coil to expose parts of the four pins.
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公开(公告)号：US11688547B2
公开(公告)日：2023-06-27
申请号：US17012919
申请日：2020-09-04
发明人： Ping-Hung Lin , Zuei-Chown Jou , Yung-Ping Wu , Chi-Ming Huang , Yao-Tsung Chen , Bo-Yu Huang
CPC分类号： H01F27/32 , H01F27/255 , H01F27/29 , H01F41/0246 , H01F41/04 , H01F41/127
摘要： An inductor device and a method of fabricating the same. The inductor device according to the invention includes a conductive coil, a pillar and a cladding body. The pillar is molded from a plurality of first composite material powders by a pressing process. Each first composite material powder is composed of a first magnetic material powder coated with a first thermosetting resin. The cladding body is molded from a plurality of second composite powders. Each second composite material powders is composed of a second magnetic material powder coated with a second thermosetting resin. The first weight ratio of the first thermosetting resin to the first composite material powders is less than the second weight ratio of the second thermosetting resin to the second composite material powders. The cladding body and the conductive coil and the pillar cladded by the cladding body are heated to a curing temperature.
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