公开(公告)号：US20170326545A1

公开(公告)日：2017-11-16

申请号：US15533680

申请日：2015-12-09

Applicant: Corning Incorporated

Inventor： Manman Kang ,  Wai Kin Poon

IPC: B01L3/00

CPC classification number: B01L3/50851 ,  B01L3/50853 ,  B01L7/52 ,  B01L2200/0689 ,  B01L2200/12 ,  B01L2300/0829 ,  B01L2300/0848 ,  B01L2300/168

Abstract: A reinforced microplate has reinforcing members that enhance stiffness and minimize deformation of the microplate, especially thermally-induced deformation. The reinforcing members include ribs or struts that are integrally formed on a bottom surface of the microplate. In cooperation with the reinforcing members, the microplate frame can include one or more slots that act to disrupt the effects of thermal expansion and limit thermally-induced strain.