公开(公告)号：US11467334B2

公开(公告)日：2022-10-11

申请号：US16638604

申请日：2018-08-20

Applicant: CORNING INCORPORATED

Inventor： Ming-Jun Li ,  Gary Richard Trott

IPC: G02B6/02 ,  G02B6/12

Abstract: The glass-based THz optical waveguides (10) disclosed herein are used to guide optical signals having a THz frequency in the range from 0.1 THz to (10) THz and include a core (20) surrounded by a cladding (30). The core has a diameter D1 in the range from (30) μm to 10 mm and is made of fused silica glass having a refractive index n1. The cladding is made of either a polymer or a glass or glass soot and has a refractive index n2

公开(公告)号：US10015879B2

公开(公告)日：2018-07-03

申请号：US15416663

申请日：2017-01-26

Applicant: Corning Incorporated

Inventor： Daniel Warren Hawtof ,  Archit Lal ,  Jen-Chieh Lin ,  Gary Richard Trott

IPC: H05K1/02 ,  H01Q9/04 ,  H01Q1/12 ,  H05K1/03 ,  H05K1/11

CPC classification number: H05K1/024 ,  H01Q1/12 ,  H01Q1/38 ,  H01Q9/04 ,  H01Q9/285 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/381 ,  H05K2201/068 ,  H05K2201/10098

Abstract: A high silica content substrate, such as for a device, is provided. The substrate has a high silica content and is thin. The substrate may include a surface with a topography or profile that facilitates bonding with a conductive metal layer, such as a metal layer for a circuit or antenna. The substrate may be flexible, have high temperature resistance, very low CTE, high strength and/or be non-reactive. The substrate may be suitable for use in circuits intended for use in high temperature environments, low temperature environments, reactive environments, or other harsh environments. The substrate may be suitable for high frequency antenna applications.

公开(公告)号：US20150099330A1

公开(公告)日：2015-04-09

申请号：US14488943

申请日：2014-09-17

Applicant: CORNING INCORPORATED

Inventor： Joseph Eugene Canale ,  Jeffrey Stapleton King ,  Gary Richard Trott

IPC: H01L21/50

CPC classification number: H01L21/50 ,  C03C17/00 ,  H01L21/02422 ,  H01L21/02444 ,  H01L21/0245 ,  H01L21/02488 ,  H01L21/02491 ,  H01L2224/16145

Abstract: The present disclosure is directed to the use of glass wafers as carriers, interposers, or in other selected applications in which electronic circuitry or operative elements, such as transistors, are formed in the creation of electronic devices. The glass wafers generally include a glass having a coefficient of thermal expansion equal to or substantially equal to a coefficient of thermal expansion of semiconductor silicon, an indexing feature, and a coating on at least a portion of one face of the glass.

Abstract translation: 本公开涉及使用玻璃晶片作为载体，中介层或其它选择的应用，其中电子电路或诸如晶体管的操作元件在形成电子器件时形成。 玻璃晶片通常包括玻璃的热膨胀系数等于或基本上等于半导体硅的热膨胀系数，分度特征和玻璃的一个面的至少一部分上的涂层。

公开(公告)号：US09159587B2

公开(公告)日：2015-10-13

申请号：US14488943

申请日：2014-09-17

Applicant: CORNING INCORPORATED

Inventor： Joseph Eugene Canale ,  Jeffrey Stapleton King ,  Gary Richard Trott

IPC: C03C17/00 ,  H01L21/58 ,  H01L21/50 ,  H01L21/02

CPC classification number: H01L21/50 ,  C03C17/00 ,  H01L21/02422 ,  H01L21/02444 ,  H01L21/0245 ,  H01L21/02488 ,  H01L21/02491 ,  H01L2224/16145

Abstract: The present disclosure is directed to the use of glass wafers as carriers, interposers, or in other selected applications in which electronic circuitry or operative elements, such as transistors, are formed in the creation of electronic devices. The glass wafers generally include a glass having a coefficient of thermal expansion equal to or substantially equal to a coefficient of thermal expansion of semiconductor silicon, an indexing feature, and a coating on at least a portion of one face of the glass.

Abstract translation: 本公开涉及使用玻璃晶片作为载体，中介层或其它选择的应用，其中电子电路或诸如晶体管的操作元件在形成电子器件时形成。 玻璃晶片通常包括玻璃的热膨胀系数等于或基本上等于半导体硅的热膨胀系数，分度特征和玻璃的一个面的至少一部分上的涂层。

公开(公告)号：US20200174180A1

公开(公告)日：2020-06-04

申请号：US16638604

申请日：2018-08-20

Applicant: CORNING INCORPORATED

Inventor： Ming-Jun Li ,  Gary Richard Trott

IPC: G02B6/02 ,  G02B6/12

Abstract: The glass-based THz optical waveguides (10) disclosed herein are used to guide optical signals having a THz frequency in the range from 0.1 THz to (10) THz and include a core (20) surrounded by a cladding (30). The core has a diameter D1 in the range from (30) μm to 10 mm and is made of fused silica glass having a refractive index n1. The cladding is made of either a polymer or a glass or glass soot and has a refractive index n2

公开(公告)号：US10106457B2

公开(公告)日：2018-10-23

申请号：US14359806

申请日：2012-11-14

Applicant: Corning Incorporated

Inventor： Robert Addison Boudreau ,  Darwin Gene Enicks ,  Charles Andrew Paulson ,  Gary Richard Trott

IPC: C03C17/245 ,  C03B17/06 ,  C23C16/455

Abstract: A method of coating a surface of a glass ribbon during a drawing process using atmospheric vapor deposition is provided. The method includes forming a glass ribbon in a viscoelastic state, desirably with a fusion draw. The glass ribbon is drawn in the viscoelastic state. The glass ribbon is cooled in the viscoelastic state into an elastic state. The glass ribbon is directed into an open end of a reactor. The reactor includes multiple channels. A first channel directs a first reactant gas, a second channel directs a second reactant gas and one or more third channels draw excess reactant, or purge it with inert gas flow, or both.

公开(公告)号：US20170215270A1

公开(公告)日：2017-07-27

申请号：US15416663

申请日：2017-01-26

Applicant: Corning Incorporated

Inventor： Daniel Warren Hawtof ,  Archit Lal ,  Jen-Chieh Lin ,  Gary Richard Trott

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H01Q9/04 ,  H01Q1/12

CPC classification number: H05K1/024 ,  H01Q1/12 ,  H01Q1/38 ,  H01Q9/04 ,  H01Q9/285 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/381 ,  H05K2201/068 ,  H05K2201/10098

Abstract: A high silica content substrate, such as for a device, is provided. The substrate has a high silica content and is thin. The substrate may include a surface with a topography or profile that facilitates bonding with a conductive metal layer, such as a metal layer for a circuit or antenna. The substrate may be flexible, have high temperature resistance, very low CTE, high strength and/or be non-reactive. The substrate may be suitable for use in circuits intended for use in high temperature environments, low temperature environments, reactive environments, or other harsh environments. The substrate may be suitable for high frequency antenna applications.

公开(公告)号：US20150193060A1

公开(公告)日：2015-07-09

申请号：US14666844

申请日：2015-03-24

Applicant: CORNING INCORPORATED

Inventor： Timothy James Orsley ,  Gary Richard Trott

IPC: G06F3/047

CPC classification number: G06F3/047 ,  G06F3/044 ,  G09G2300/04 ,  Y10T156/10 ,  Y10T156/1052 ,  Y10T156/1075

Abstract: Methods and apparatus provide for a touch sensitive display, which may include: a display layer; a cover glass layer formed from ion exchanged glass; and an optional touch glass layer, where, either on a first side of the touch glass or on a first side of the cover glass, a grid of electrode traces is disposed, which is sensitive to distortions of a local electrostatic field caused by a touching event, and the grid may be positioned between the display layer and the cover glass layer.

Abstract translation: 方法和装置提供一种触敏显示器，其可以包括：显示层; 由离子交换玻璃形成的覆盖玻璃层; 和可选的触摸玻璃层，其中，在触摸玻璃的第一侧或者盖玻璃的第一侧，布置电极迹线格栅，其对由触摸引起的局部静电场的变形敏感 事件，并且网格可以位于显示层和覆盖玻璃层之间。