公开(公告)号：US20140248059A1

公开(公告)日：2014-09-04

申请号：US13781892

申请日：2013-03-01

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Norman Tang ,  Liang Ping Peng ,  David Lai ,  Anthony Nguyen ,  Steven A. Hanssen

IPC: H04B10/40

CPC classification number: H04B10/40 ,  H04L49/352

Abstract: Techniques are provided for sending and receiving data communications between an enhanced Quad Small Form-Factor Pluggable (QSFP+) transceiver module and an enhanced Small Form-Factor Pluggable (SFP+) transceiver module. An adapter device is provided that has a first set of signal pins configured to interface with an SFP+ transceiver module and a second set of signal pins is provided that is configured to interface with a QSFP+ host port. A retimer unit is also provided that is configured to modify a 10G signal of a first electrical signal standard associated with the SFP+ transceiver module to a 10G signal of a second electrical standard associated with a QSFP+ transceiver module and to enhance a 10G signal of the second electrical signal standard to a 10G signal of the first electrical signal standard.

Abstract translation: 提供了一种技术，用于在增强型四核小型可插拔（QSFP +）收发器模块和增强型小型可插拔（SFP +）收发器模块之间发送和接收数据通信。 提供一种适配器装置，其具有被配置为与SFP +收发器模块接口的第一组信号引脚，并且提供被配置为与QSFP +主机端口接口的第二组信号引脚。 还提供重定时器单元，其被配置为将与SFP +收发器模块相关联的第一电信号标准的10G信号修改为与QSFP +收发器模块相关联的第二电标准的10G信号，并且增强第二 电信号标准为10G信号的第一电信号标准。

公开(公告)号：US10734306B2

公开(公告)日：2020-08-04

申请号：US16137650

申请日：2018-09-21

Applicant: Cisco Technology, Inc.

Inventor： Vic Chia ,  Hong Huynh ,  Steven A. Hanssen ,  Robert Gregory Twiss

IPC: H01L23/40 ,  F16B5/02

Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.

公开(公告)号：US20190027422A1

公开(公告)日：2019-01-24

申请号：US16137650

申请日：2018-09-21

Applicant: Cisco Technology, Inc.

Inventor： Vic Chia ,  Hong Huynh ,  Steven A. Hanssen ,  Robert Gregory Twiss

IPC: H01L23/40 ,  F16B5/02

CPC classification number: H01L23/4006 ,  F16B5/0266 ,  H01L2023/4081 ,  H01L2023/4087

Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.

公开(公告)号：US20160054527A1

公开(公告)日：2016-02-25

申请号：US14467033

申请日：2014-08-24

Applicant: Cisco Technology, Inc.

Inventor： Norman Tang ,  Steven A. Hanssen ,  David Lai ,  Liang Ping Peng ,  Anthony Nguyen

IPC: G02B6/38 ,  H01R43/26 ,  H01R13/58 ,  H01R13/631 ,  H01R13/717 ,  H01R13/633

CPC classification number: G02B6/3893 ,  G02B6/3895 ,  H01R13/58 ,  H01R13/631 ,  H01R13/633 ,  H01R13/7175 ,  H01R43/26 ,  H04Q1/136

Abstract: Various implementations disclosed herein include apparatuses, systems, and methods for providing pull tabs for pluggable transceiver modules and/or adaptor modules. A pluggable transceiver module may include a pull tab that may have a visual indicator portion to provide a visual indication of the status of a pluggable transceiver module and/or the status of a network connection. The pluggable transceiver module may also include one or more LEDs, one or more wires, one or more light pipes, one or more latching components, and/or one or more tension components. An adaptor module may include a pull tab that may have a visual indicator portion to provide a visual indication of whether a pluggable transceiver module is compatible with the adaptor module. The adaptor module may also include one or more LEDs, one or more wires, one or more light pipes, one or more latching components, and/or one or more tension components.

Abstract translation: 本文公开的各种实施方案包括用于为可插拔收发器模块和/或适配器模块提供拉片的装置，系统和方法。 可插拔收发器模块可以包括拉片，其可以具有可视指示器部分，以提供可插拔收发器模块的状态的视觉指示和/或网络连接的状态。 可插拔收发器模块还可以包括一个或多个LED，一个或多个电线，一个或多个光管，一个或多个闭锁部件和/或一个或多个张紧部件。 适配器模块可以包括拉片，其可以具有可视指示器部分，以提供可插拔收发器模块是否与适配器模块兼容的可视指示。 适配器模块还可以包括一个或多个LED，一个或多个电线，一个或多个光管，一个或多个闭锁部件和/或一个或多个张紧部件。

公开(公告)号：US20200328136A1

公开(公告)日：2020-10-15

申请号：US16913663

申请日：2020-06-26

Applicant: Cisco Technology, Inc.

Inventor： Vic Chia ,  Hong Huynh ,  Steven A. Hanssen ,  Robert Gregory Twiss

IPC: H01L23/40 ,  F16B5/02

Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.

公开(公告)号：US10109558B2

公开(公告)日：2018-10-23

申请号：US14740898

申请日：2015-06-16

Applicant: Cisco Technology, Inc.

Inventor： Vic Chia ,  Hong Huynh ,  Steven A. Hanssen ,  Robert Gregory Twiss

IPC: H01L23/40 ,  F16B5/02

Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.

公开(公告)号：US20160374232A1

公开(公告)日：2016-12-22

申请号：US14740898

申请日：2015-06-16

Applicant: Cisco Technology, Inc.

Inventor： Vic Chia ,  Hong Huynh ,  Steven A. Hanssen ,  Robert Gregory Twiss

IPC: H05K7/20

CPC classification number: H01L23/4006 ,  F16B5/0266 ,  H01L2023/4081 ,  H01L2023/4087

Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.

Abstract translation: 提供了散热器安装配置，其被配置为当线卡经受振动时，防止散热器损坏安装在印刷电路板（PCB）上的专用集成电路（ASIC）的球栅阵列（BGA），并且 冲击。 散热器安装配置可以包括一组螺钉，其被配置为至少部分地设置在散热器的孔内，以将散热器固定到PCB。 安装构造包括弹性构件和围绕靠近孔的螺钉周围的间隔件。 弹性构件构造成将散热器偏压在ASIC上以使散热器与ASIC接触。 间隔件构造成防止散热器在线卡受到振动和冲击时大到足以损坏BGA的力撞击ASIC。

公开(公告)号：US09077452B2

公开(公告)日：2015-07-07

申请号：US13781892

申请日：2013-03-01

Applicant: Cisco Technology, Inc.

Inventor： Norman Tang ,  Liang Ping Peng ,  David Lai ,  Anthony Nguyen ,  Steven A. Hanssen

IPC: H04B10/40 ,  H04L12/931

CPC classification number: H04B10/40 ,  H04L49/352

Abstract: Techniques are provided for sending and receiving data communications between an enhanced Quad Small Form-Factor Pluggable (QSFP+) transceiver module and an enhanced Small Form-Factor Pluggable (SFP+) transceiver module. An adapter device is provided that has a first set of signal pins configured to interface with an SFP+ transceiver module and a second set of signal pins is provided that is configured to interface with a QSFP+ host port. A retimer unit is also provided that is configured to modify a 10G signal of a first electrical signal standard associated with the SFP+ transceiver module to a 10G signal of a second electrical standard associated with a QSFP+ transceiver module and to enhance a 10G signal of the second electrical signal standard to a 10G signal of the first electrical signal standard.

Abstract translation: 提供了一种技术，用于在增强型四核小型可插拔（QSFP +）收发器模块和增强型小型可插拔（SFP +）收发器模块之间发送和接收数据通信。 提供一种适配器装置，其具有被配置为与SFP +收发器模块接口的第一组信号引脚，并且提供被配置为与QSFP +主机端口接口的第二组信号引脚。 还提供重定时器单元，其被配置为将与SFP +收发器模块相关联的第一电信号标准的10G信号修改为与QSFP +收发器模块相关联的第二电标准的10G信号，并且增强第二 电信号标准为10G信号的第一电信号标准。

公开(公告)号：US20150155963A1

公开(公告)日：2015-06-04

申请号：US14096392

申请日：2013-12-04

Applicant: Cisco Technology, Inc.

Inventor： Norman Tang ,  Liang Ping Peng ,  David Lai ,  Anthony Nguyen ,  Steven A. Hanssen

IPC: H04J14/02 ,  H04L7/00 ,  H04B10/40

CPC classification number: H04B10/40 ,  G02B6/4285 ,  H04J3/047

Abstract: An upscaling transceiver module is provided that is configured to provide data connectivity between transceiver modules. The upscaling transceiver module comprises a first connector and a second connector. The first connector is configured to interface with a first port of a host device, and the second connector is configured to interface with a second port of a second host device. The connectors support exchange of 10G signals. The upscaling transceiver module also comprises a multiplexing unit and a demultiplexing unit. The multiplexing unit receives a first and second 10G transmission signals. The multiplexing unit combines the first and second 10G transmission signals into a twenty gigabit per second (20G) transmission signal. The demultiplexing unit obtains a 20G receive signal from a system device and splits the 20G receive signal into first and second 10G receive signals.

Abstract translation: 提供了一种升高收发器模块，其被配置为在收发器模块之间提供数据连接。 升高收发器模块包括第一连接器和第二连接器。 第一连接器被配置为与主机设备的第一端口接口，并且第二连接器被配置为与第二主机设备的第二端口接口。 连接器支持10G信号的交换。 升频收发模块还包括复用单元和解复用单元。 复用单元接收第一和第二10G传输信号。 复用单元将第一和第二10G传输信号组合成二十吉比特每秒（20G）传输信号。 解复用单元从系统设备获得20G接收信号，并将20G接收信号分解为第一和第二10G接收信号。