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公开(公告)号：US10734306B2
公开(公告)日：2020-08-04
申请号：US16137650
申请日：2018-09-21
Applicant: Cisco Technology, Inc.
Inventor： Vic Chia , Hong Huynh , Steven A. Hanssen , Robert Gregory Twiss
Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.
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公开(公告)号：US20190027422A1
公开(公告)日：2019-01-24
申请号：US16137650
申请日：2018-09-21
Applicant: Cisco Technology, Inc.
Inventor： Vic Chia , Hong Huynh , Steven A. Hanssen , Robert Gregory Twiss
CPC classification number: H01L23/4006 , F16B5/0266 , H01L2023/4081 , H01L2023/4087
Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.
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Patent Agency Ranking
公开(公告)号：US09927852B2
公开(公告)日：2018-03-27
申请号：US14834455
申请日：2015-08-25
Applicant: Cisco Technology, Inc.
Inventor： Vic Chia , Long Huu Dang , Hong Huynh
CPC classification number: G06F1/20 , A47B47/0075 , G06F1/182 , G06F1/183 , H05K7/20563 , H05K9/0062
Abstract: In one embodiment, a slot-filler blanking tray includes a vented blanking panel including a vented front panel, the vented blanking panel for fitting over an entrance to one slot of a computer equipment rack including support rails, and a panel arrangement including partition panels to form a slot partition for reversibly inserting into the one slot, supported by the support rails, the slot partition being formed either by unfolding the partition panels or fitting the partition panels together, wherein (a) the vented blanking panel and at least one partition panel of the partition panels are mechanically connected together, or (b) the vented blanking panel includes a first connecting element and the at least one partition panel includes a second connecting element to mechanically connect the vented blanking panel and the at least one partition panel together. Related apparatus and methods are also described.
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公开(公告)号：US20160374232A1
公开(公告)日：2016-12-22
申请号：US14740898
申请日：2015-06-16
Applicant: Cisco Technology, Inc.
Inventor： Vic Chia , Hong Huynh , Steven A. Hanssen , Robert Gregory Twiss
IPC: H05K7/20
CPC classification number: H01L23/4006 , F16B5/0266 , H01L2023/4081 , H01L2023/4087
Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.
Abstract translation: 提供了散热器安装配置，其被配置为当线卡经受振动时，防止散热器损坏安装在印刷电路板（PCB）上的专用集成电路（ASIC）的球栅阵列（BGA），并且 冲击。 散热器安装配置可以包括一组螺钉，其被配置为至少部分地设置在散热器的孔内，以将散热器固定到PCB。 安装构造包括弹性构件和围绕靠近孔的螺钉周围的间隔件。 弹性构件构造成将散热器偏压在ASIC上以使散热器与ASIC接触。 间隔件构造成防止散热器在线卡受到振动和冲击时大到足以损坏BGA的力撞击ASIC。
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公开(公告)号：US20200328136A1
公开(公告)日：2020-10-15
申请号：US16913663
申请日：2020-06-26
Applicant: Cisco Technology, Inc.
Inventor： Vic Chia , Hong Huynh , Steven A. Hanssen , Robert Gregory Twiss
Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.
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公开(公告)号：US10109558B2
公开(公告)日：2018-10-23
申请号：US14740898
申请日：2015-06-16
Applicant: Cisco Technology, Inc.
Inventor： Vic Chia , Hong Huynh , Steven A. Hanssen , Robert Gregory Twiss
Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.
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公开(公告)号：US20170060197A1
公开(公告)日：2017-03-02
申请号：US14834455
申请日：2015-08-25
Applicant: Cisco Technology, Inc.
Inventor： Vic CHIA , Long Huu Dang , Hong Huynh
CPC classification number: G06F1/20 , A47B47/0075 , G06F1/182 , G06F1/183 , H05K7/20563 , H05K9/0062
Abstract: In one embodiment, a slot-filler blanking tray includes a vented blanking panel including a vented front panel, the vented blanking panel for fitting over an entrance to one slot of a computer equipment rack including support rails, and a panel arrangement including partition panels to form a slot partition for reversibly inserting into the one slot, supported by the support rails, the slot partition being formed either by unfolding the partition panels or fitting the partition panels together, wherein (a) the vented blanking panel and at least one partition panel of the partition panels are mechanically connected together, or (b) the vented blanking panel includes a first connecting element and the at least one partition panel includes a second connecting element to mechanically connect the vented blanking panel and the at least one partition panel together. Related apparatus and methods are also described.
Abstract translation: 在一个实施例中，狭槽填料冲裁托盘包括排气的冲裁板，其包括通风的前面板，用于装配在包括支撑轨道的计算机设备机架的一个槽的入口上的排气的冲裁板，以及包括分隔板的面板装置 形成用于可逆地插入到由支撑轨道支撑的一个槽中的槽分隔件，槽分隔件通过展开分隔板或将隔板装配在一起而形成，其中（a）通气的冲裁板和至少一个分隔板 分隔板的机械连接在一起，或（b）排气的冲切板包括第一连接元件，并且所述至少一个分隔板包括第二连接元件，以将通风的冲切板和至少一个分隔板机械连接在一起。 还描述了相关装置和方法。
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