公开(公告)号：US11668875B2

公开(公告)日：2023-06-06

申请号：US16836768

申请日：2020-03-31

Applicant: Cisco Technology, Inc.

Inventor： Ashley J. M. Erickson ,  Matthew J. Traverso

IPC: G02B6/12 ,  G02B6/24 ,  G02B6/26 ,  G02B6/28 ,  G02B6/35 ,  G02B23/08 ,  G02B6/30 ,  G02B6/125

CPC classification number: G02B6/24 ,  G02B6/12 ,  G02B6/12002 ,  G02B6/12004 ,  G02B6/264 ,  G02B6/2804 ,  G02B6/2821 ,  G02B6/3528 ,  G02B6/125 ,  G02B6/30 ,  G02B6/3596 ,  G02B23/08 ,  G02B2006/12104

Abstract: Periscope assemblies are provided which have a light path that travels in a first plane along the first waveguide, a second plane along the second waveguide that is parallel to the first plane, and along a third plane along the third waveguide that intersects the first plane and the second plane. In some examples the periscope assembly includes first and second carriers comprising respective first and second waveguides and defining respective first and second cavities in which a third carrier comprising a third waveguide is disposed and optionally includes an optical component. In some examples, the cavities are defined in one or more carriers on a mating surface, on a side opposite to the mating surface, or on a side perpendicular to a mating surface.

公开(公告)号：US12044884B2

公开(公告)日：2024-07-23

申请号：US17653195

申请日：2022-03-02

Applicant: Cisco Technology, Inc.

Inventor： Matthew J. Traverso ,  Jock T. Bovington ,  Ashley J. M. Erickson

IPC: G02B6/12 ,  G02B6/13 ,  G02B6/30 ,  G02B6/42

CPC classification number: G02B6/13 ,  G02B6/12004 ,  G02B6/30 ,  G02B6/4212

Abstract: Solder reflow compatible connections between optical components are provided by use of reflow compatible epoxies to bond optical components and remain bonded between the optical components at temperatures of at least 260 degrees Celsius for at least five minutes. In some embodiments, the reflow compatible epoxy is index matched to the optical channels in the optical components and is disposed in the light path therebetween. In some embodiments, a light path is defined between the optical channels through at least a portion of an air gap between the optical components.

公开(公告)号：US11756861B2

公开(公告)日：2023-09-12

申请号：US17663072

申请日：2022-05-12

Applicant: Cisco Technology, Inc.

Inventor： Ashley J. M. Erickson ,  Matthew J. Traverso ,  Sandeep Razdan ,  Joyce J. M. Peternel ,  Aparna R. Prasad

IPC: H01L23/473 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00 ,  H01L21/78 ,  H01L23/544

CPC classification number: H01L23/473 ,  H01L21/4803 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/544 ,  H01L24/32 ,  H01L24/83 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2223/54426 ,  H01L2224/32225

Abstract: An opto-electronic package is described. The opto-electronic package is manufactured using a fan out wafer level packaging to produce dies/frames which include connection features. Additional structures such as heat exchanged structures are joined to a connection component and affixed to packages, using the connection features, to provide structural support and heat exchange to heat generating components in the package, among other functions.

公开(公告)号：US11353668B2

公开(公告)日：2022-06-07

申请号：US17070763

申请日：2020-10-14

Applicant: Cisco Technology, Inc.

Inventor： Ashley J. M. Erickson ,  Vipulkumar K. Patel ,  Aparna R. Prasad

IPC: G02B6/42 ,  G02B6/13 ,  G02B6/12

Abstract: An integrated circuit (IC) package having multiple ICs is provided. The IC package includes a printed circuit board (PCB) having a cutout region and a substrate disposed above the PCB. The substrate includes a first cavity on a first surface of the substrate. The IC package also includes a first IC disposed on a second surface of the substrate and in the cutout region of the PCB, The IC package further includes a second IC disposed above the substrate, and a first device disposed on the second IC and in the first cavity on the first surface of the substrate.

公开(公告)号：US11373930B2

公开(公告)日：2022-06-28

申请号：US16836825

申请日：2020-03-31

Applicant: Cisco Technology, Inc.

Inventor： Ashley J. M. Erickson ,  Matthew J. Traverso ,  Sandeep Razdan ,  Joyce J. M. Peternel ,  Aparna R. Prasad

IPC: H01L23/473 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00 ,  H01L21/78 ,  H01L23/544

Abstract: An opto-electronic package is described. The opto-electronic package is manufactured using a fan out wafer level packaging to produce dies/frames which include connection features. Additional structures such as heat exchanged structures are joined to a connection component and affixed to packages, using the connection features, to provide structural support and heat exchange to heat generating components in the package, among other functions.

公开(公告)号：US11300728B2

公开(公告)日：2022-04-12

申请号：US16787632

申请日：2020-02-11

Applicant: Cisco Technology, Inc.

Inventor： Matthew J. Traverso ,  Jock T. Bovington ,  Ashley J. M. Erickson

IPC: G02B6/12 ,  G02B6/13 ,  G02B6/42 ,  G02B6/30

Abstract: Solder reflow compatible connections between optical components are provided by use of reflow compatible epoxies to bond optical components and remain bonded between the optical components at temperatures of at least 260 degrees Celsius for at least five minutes. In some embodiments, the reflow compatible epoxy is index matched to the optical channels in the optical components and is disposed in the light path therebetween. In some embodiments, a light path is defined between the optical channels through at least a portion of an air gap between the optical components.