公开(公告)号：US20120218648A1

公开(公告)日：2012-08-30

申请号：US13035391

申请日：2011-02-25

Applicant: Chun-Chi LIN ,  Jau-Jan DENG ,  Wei-Ping CHEN

Inventor： Chun-Chi LIN ,  Jau-Jan DENG ,  Wei-Ping CHEN

IPC: G02B13/18

CPC classification number: G02B13/003 ,  G02B5/005 ,  G02B9/02 ,  G02B9/04 ,  G02B9/08 ,  G02B13/004 ,  G02B13/0085 ,  H01L27/14618 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Image capture lens modules and wafer level packaged image capture devices are presented. The image capture lens module includes a compound lens with a first lens element and a second lens element molded on both sides of a substrate, and a field stop disposed at an interface between the first lens element and the substrate or at an interface between the second lens element and the substrate, wherein the field stop is a coating layer with a polygonal transparent area.

Abstract translation: 提出了图像采集镜头模块和晶片级封装图像捕获设备。 图像拍摄透镜模块包括具有第一透镜元件和模制在基板的两侧上的第二透镜元件的复合透镜，以及设置在第一透镜元件和基板之间或第二透镜元件的第二透镜元件 透镜元件和基板，其中场挡板是具有多边形透明区域的涂层。

公开(公告)号：US20130028589A1

公开(公告)日：2013-01-31

申请号：US13189899

申请日：2011-07-25

Applicant: Pai-Chun Peter ZUNG ,  Jau-Jan DENG ,  Wei-Ping CHEN

Inventor： Pai-Chun Peter ZUNG ,  Jau-Jan DENG ,  Wei-Ping CHEN

IPC: G03B17/00 ,  B23P11/00

CPC classification number: G02B7/021 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14683 ,  H01L2224/13 ,  H04N5/2251 ,  H04N5/2257 ,  Y10T29/49826

Abstract: The invention provides a compact camera module and a method for fabricating the same. A compact camera module includes an image sensor device package. A back spacer ring is disposed on the image sensor device package. A first edge of the back spacer ring is aligned to a second edge of the image sensor device package. An optical lens plate disposed over the back spacer ring. A front spacer ring is sandwiched between the back spacer ring and the optical lens plate. A third edge of the front spacer ring is aligned to a fourth edge of the optical lens plate.

Abstract translation: 本发明提供一种紧凑型相机模块及其制造方法。 小型相机模块包括图像传感器装置包装。 后隔离环设置在图像传感器装置封装上。 后间隔环的第一边缘对准图像传感器装置包装的第二边缘。 设置在后隔离环上的光学透镜板。 前间隔环夹在后间隔环和光学透镜板之间。 前间隔环的第三边缘与光学透镜板的第四边缘对准。