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公开(公告)号：US11516904B2
公开(公告)日：2022-11-29
申请号：US17455386
申请日：2021-11-17
申请人： CelLink Corporation
发明人： Kevin Michael Coakley , Malcolm Parker Brown , Jose Juarez , Emily Hernandez , Joseph Pratt , Peter Stone , Vidya Viswanath , Will Findlay
摘要： Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
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公开(公告)号：US11206730B2
公开(公告)日：2021-12-21
申请号：US16950155
申请日：2020-11-17
申请人： CelLink Corporation
发明人： Kevin Michael Coakley , Malcolm Parker Brown , Jose Juarez , Emily Hernandez , Joseph Pratt , Peter Stone , Vidya Viswanath , Will Findlay
摘要： Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
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公开(公告)号：US20210076485A1
公开(公告)日：2021-03-11
申请号：US16950155
申请日：2020-11-17
申请人： CelLink Corporation
发明人： Kevin Michael Coakley , Malcolm Parker Brown , Jose Juarez , Emily Hernandez , Joseph Pratt , Peter Stone , Vidya Viswanath , Will Findlay
摘要： Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
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公开(公告)号：US20200245449A1
公开(公告)日：2020-07-30
申请号：US16850340
申请日：2020-04-16
申请人： CelLink Corporation
发明人： Kevin Michael Coakley , Malcolm Parker Brown , Jose Juarez , Emily Hernandez , Joseph Pratt , Peter Stone , Vidya Viswanath , Will Findlay
摘要： Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
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公开(公告)号：US20230371174A1
公开(公告)日：2023-11-16
申请号：US18351437
申请日：2023-07-12
申请人： CelLink Corporation
发明人： Jean-Paul Ortiz , Malcom Parker Brown , Mark Terlaak , Will Findlay , Kevin Michael Coakley , Casey Anderson
CPC分类号： H05K1/028 , H05K1/0296 , H05K3/02 , H05K2201/055
摘要： Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.
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公开(公告)号：US20230101123A1
公开(公告)日：2023-03-30
申请号：US18060283
申请日：2022-11-30
申请人： CelLink Corporation
摘要： Provided are terminal-free connectors for flexible interconnect circuits. A connector for connecting to a flexible interconnect circuit comprises a base comprising a housing chamber defined by at least a first side wall and a second side wall that are oppositely positioned about the base. A circuit clamp is coupled to the base via a first hinge, and is configured to move between a released position and a clamped position. A cover piece is coupled to the base via a second hinge, and is configured to move between an open position and a closed position. The circuit clamp is configured to secure the flexible interconnect circuit between the base and the circuit clamp in the clamped position. One or more protrusions on the circuit clamp are each configured to interface with a socket within the first or second side wall to secure the circuit clamp in the clamped position.
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公开(公告)号：US11545773B2
公开(公告)日：2023-01-03
申请号：US16939912
申请日：2020-07-27
申请人： CelLink Corporation
摘要： Provided are terminal-free connectors for flexible interconnect circuits. A connector for connecting to a flexible interconnect circuit comprises a base comprising a housing chamber defined by at least a first side wall and a second side wall that are oppositely positioned about the base. A circuit clamp is coupled to the base via a first hinge, and is configured to move between a released position and a clamped position. A cover piece is coupled to the base via a second hinge, and is configured to move between an open position and a closed position. The circuit clamp is configured to secure the flexible interconnect circuit between the base and the circuit clamp in the clamped position. One or more protrusions on the circuit clamp are each configured to interface with a socket within the first or second side wall to secure the circuit clamp in the clamped position.
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公开(公告)号：US12052814B2
公开(公告)日：2024-07-30
申请号：US18051289
申请日：2022-10-31
申请人： CelLink Corporation
发明人： Kevin Michael Coakley , Malcom Parker Brown , Jose Juarez , Emily Hernandez , Joseph Pratt , Peter Stone , Vidya Viswanath , Will Findlay
CPC分类号： H05K1/0219 , H01B11/00 , H05K1/0237 , H05K1/028 , H05K1/0326 , H05K2201/0145
摘要： Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
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公开(公告)号：US12010792B2
公开(公告)日：2024-06-11
申请号：US18351437
申请日：2023-07-12
申请人： CelLink Corporation
发明人： Jean-Paul Ortiz , Malcom Parker Brown , Mark Terlaak , Will Findlay , Kevin Michael Coakley , Casey Anderson
CPC分类号： H05K1/028 , H05K1/0296 , H05K3/02 , H05K2201/055
摘要： Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.
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公开(公告)号：US11888180B2
公开(公告)日：2024-01-30
申请号：US18352466
申请日：2023-07-14
申请人： CelLink Corporation
IPC分类号： H01M50/526 , H01M50/533 , H01M50/50 , H01M50/503 , H01M50/555 , H01M50/522 , H01M50/516 , H01M50/502 , H01M50/569
CPC分类号： H01M50/526 , H01M50/50 , H01M50/502 , H01M50/516 , H01M50/522 , H01M50/533 , H01M50/569 , H01M50/503 , H01M50/555
摘要： Provided are multilayered flexible battery interconnects for interconnecting batteries in battery packs and methods of fabricating thereof. A multilayered flexible battery interconnect comprises insulating layers and two conductive layers, stacked together and positioned between the insulating layers. One conductive layer is thicker than the other. The thinner conductive layer comprises flexible tabs for connecting to batteries and, in some examples, comprises voltage sense traces. The smaller thickness of these flexible tabs ensures welding quality and allows using less energy during welding. The battery cell contacts, to which these flexible tabs are welded, can be significantly thicker. Furthermore, the smaller thickness enables fusible link integration into flexible tabs. At the same time, the two conductive layers collectively conduct current within the interconnect, with the thicker layer enhancing the overall current-carrying capacity. The two conductive layers can be welded together to ensure electric connections and mechanical support.
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