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Patent Agency Ranking
公开(公告)号：US20190364701A1
公开(公告)日：2019-11-28
申请号：US16536394
申请日：2019-08-09
Applicant: CareFusion 303, Inc.
Inventor： Michael RAHILLY , Edward Stephen FERNER, JR. , Brendan John BURGESS , Scott RILEY , Michael Dugan JOYCE , Noe ARROYO , Chris PEDERSEN
Abstract: A door assembly is described. The door assembly includes a door structure that is mounted over an opening of an enclosure. The door structure includes a body that includes a first surface and a second surface opposite to the first surface. The first surface may face an inside of the enclosure when the door structure is closed. The door structure includes a number of finger bracket structures mounted on the first surface. Each one of the finger bracket structures includes a bracket and one or more finger gaskets coupled to the bracket. The finger gaskets of the finger bracket structures may contact enclosure brackets mounted around an edge of the opening of the enclosure when the door structure is closed. A combination of the finger gaskets in contact with enclosure brackets may create an electromagnetic interference (EMI) shield at the edge of the opening of the enclosure.
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公开(公告)号：US20200375072A1
公开(公告)日：2020-11-26
申请号：US16991654
申请日：2020-08-12
Applicant: CareFusion 303, Inc.
Inventor： Michael RAHILLY , Edward Stephen FERNER, JR. , Brendan John BURGESS , Scott RILEY , Michael Dugan JOYCE , Noe ARROYO , Chris PEDERSEN
Abstract: A door assembly is described. The door assembly includes a door structure that is mounted over an opening of an enclosure. The door structure includes a body that includes a first surface and a second surface opposite to the first surface. The first surface may face an inside of the enclosure when the door structure is closed. The door structure includes a number of finger bracket structures mounted on the first surface. Each one of the finger bracket structures includes a bracket and one or more finger gaskets coupled to the bracket. The finger gaskets of the finger bracket structures may contact enclosure brackets mounted around an edge of the opening of the enclosure when the door structure is closed. A combination of the finger gaskets in contact with enclosure brackets may create an electromagnetic interference (EMI) shield at the edge of the opening of the enclosure.
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公开(公告)号：US20220192063A1
公开(公告)日：2022-06-16
申请号：US17687165
申请日：2022-03-04
Applicant: CareFusion 303, Inc.
Inventor： Michael RAHILLY , Edward Stephen FERNER, JR. , Brendan John BURGESS , Scott RILEY , Michael Dugan JOYCE , Noe ARROYO , Chris PEDERSEN
Abstract: A shield assembly includes a closing structure configured to be disposed over an opening of an enclosure. The closing structure includes an inner surface configured to face an inside of the enclosure when the closing structure is closed and a finger bracket structure mounted on the inner surface, the finger bracket structure having a bracket and one or more finger gaskets coupled to the bracket. An electromagnetic interference (EMI) shielded gasket disposed along a portion of the opening of the enclosure shields an edge of the opening of the enclosure or a radio frequency (RF) fence bracket coupled to a frame disposed around the opening of the enclosure creates a narrow path between the frame and the closing structure, the narrow path attenuating RF signals passing through the narrow path and shielding an edge of the opening of the enclosure.
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公开(公告)号：US20170083060A1
公开(公告)日：2017-03-23
申请号：US15369641
申请日：2016-12-05
Applicant: CareFusion 303, Inc.
Inventor： David H. NICOL , Michael Dugan JOYCE , Brendan BURGESS
CPC classification number: G06F1/20 , G06F1/182 , G06F19/00 , G06F19/3456 , H05K7/20127 , H05K7/20336 , H05K7/2039 , H05K9/0041 , Y10T29/49117
Abstract: An electronics enclosure is disclosed that provides passive cooling of electronic components while reducing electromagnetic interference (EMI) emissions. The electronics enclosure includes an electronics assembly with at least one electronic component and a heat sink coupled to the electronics assembly. The heat sink has a base portion configured to thermally couple to the at least one electronic component when the heat sink is coupled to the electronic assembly. The electronics enclosure also includes a conductive enclosure forming an enclosed volume around the electronics assembly. The enclosure has a first opening configured to fit around the heat sink and at least one second opening. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a determined maximum shielding frequency.
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公开(公告)号：US20150035420A1
公开(公告)日：2015-02-05
申请号：US14463566
申请日：2014-08-19
Applicant: CareFusion 303, Inc.
Inventor： David H. NICOL , Michael Dugan JOYCE , Brendan BURGESS
CPC classification number: G06F1/20 , G06F1/182 , G06F19/00 , G06F19/3456 , H05K7/20127 , H05K7/20336 , H05K7/2039 , H05K9/0041 , Y10T29/49117
Abstract: An electronics enclosure is disclosed that provides passive cooling of electronic components while reducing electromagnetic interference (EMI) emissions. The electronics enclosure includes an electronics assembly with at least one electronic component and a heat sink coupled to the electronics assembly. The heat sink has a base portion configured to thermally couple to the at least one electronic component when the heat sink is coupled to the electronic assembly. The electronics enclosure also includes a conductive enclosure forming an enclosed volume around the electronics assembly. The enclosure has a first opening configured to fit around the heat sink and at least one second opening. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a determined maximum shielding frequency.
Abstract translation: 公开了一种电子外壳，其提供电子部件的被动冷却，同时减少电磁干扰（EMI）发射。 电子外壳包括具有至少一个电子部件和耦合到电子组件的散热器的电子组件。 散热器具有基座部分，其构造成当散热器耦合到电子组件时热耦合到至少一个电子部件。 电子外壳还包括形成围绕电子组件的封闭容积的导电外壳。 所述外壳具有构造成围绕所述散热器和至少一个第二开口配合的第一开口。 从体积到外部环境的所有非导电通道具有至少一个横截面开口，该截面开口具有连续的导电周边，在确定的最大屏蔽频率的小于四分之一波长的开口内具有最大线性长度。
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