-
公开(公告)号：US09544989B2
公开(公告)日：2017-01-10
申请号：US14945073
申请日：2015-11-18
申请人： CYNTEC CO., LTD.
IPC分类号： H01H9/28 , H05K5/00 , H05K1/02 , H05K9/00 , H05K1/00 , H05K7/00 , H05K1/11 , H05K1/18 , H02B5/00
CPC分类号： H05K1/0216 , H05K1/00 , H05K1/0233 , H05K1/0243 , H05K1/025 , H05K1/111 , H05K1/181 , H05K5/00 , H05K5/0026 , H05K7/00 , H05K9/0022 , H05K2201/08 , H05K2201/1003
摘要： A network communication device is disclosed. The network communication device includes a circuit board, a network connector, a network chip and a plurality of network magnetic assemblies. The network connector, the network chip and the network magnetic assemblies are disposed on the circuit board. The network magnetic assemblies are electrically connected with the network connector and the network chip, respectively. Each of the network magnetic assemblies includes an Ethernet transformer and at least one inductor. The Ethernet transformer is electrically connected in series with the inductor via a conductive trace of the circuit board. Any two adjacent Ethernet transformers are separately arranged with a gap having a second specific length.
摘要翻译： 公开了一种网络通信设备。 网络通信设备包括电路板，网络连接器，网络芯片和多个网络磁性组件。 网络连接器，网络芯片和网络磁性组件设置在电路板上。 网络磁性组件分别与网络连接器和网络芯片电连接。 每个网络磁性组件包括以太网变压器和至少一个电感器。 以太网变压器通过电路板的导电迹线与电感器串联电连接。 任何两个相邻的以太网变压器分别布置有具有第二特定长度的间隙。
-
公开(公告)号：US09455081B2
公开(公告)日：2016-09-27
申请号：US14061774
申请日：2013-10-24
申请人： CYNTEC CO., LTD.
发明人： Shih-Hsien Tseng
CPC分类号： H01F27/2804 , H01F41/046 , Y10T29/4902 , Y10T29/49069 , Y10T29/49071 , Y10T29/49073 , Y10T29/49075
摘要： A method of producing an inductor with high inductance includes forming a removable polymer layer on a temporary carrier; forming a structure including a first coil, a second coil, and a dielectric layer on the removable polymer layer; forming a first magnetic glue layer on the removable polymer layer and the structure; removing the temporary carrier; and forming a second magnetic glue layer below the structure and the first magnetic glue layer.
-
公开(公告)号：US20150070106A1
公开(公告)日：2015-03-12
申请号：US14549557
申请日：2014-11-21
申请人： CYNTEC CO., LTD.
发明人： Shih-Hsien Tseng
CPC分类号： H03H7/0115 , G06F17/30053 , G11B27/031 , G11B27/105 , H03H3/007 , H03H7/0138 , H03H2001/0085
摘要： A circuit structure is disclosed, wherein the circuit structure comprises: a substrate comprising a top surface, a bottom surface and lateral surfaces connecting the top surface and the bottom surface; a plurality of conductive layers disposed over the top surface of the substrate, wherein a dielectric layer is disposed between each two adjacent conductive layers, wherein at least one capacitor is formed by a first portion of the plurality of conductive layers with the dielectric layers therebetween, and wherein at least one first inductor is formed by a second portion of the plurality of conductive layers; and at least one conductive pattern layer disposed over at least one of the lateral surface to form at least one second inductor, wherein a third portion of the plurality of conductive layers electrically connects with said at least one capacitor, said at least one first inductor and said at least one second inductor.
摘要翻译： 公开了一种电路结构，其中电路结构包括：基板，包括顶表面，底表面和连接顶表面和底表面的侧表面; 多个导电层，其布置在所述基板的顶表面上，其中介电层设置在每个相邻的两个导电层之间，其中至少一个电容器由所述多个导电层的第一部分形成，其间具有介电层， 并且其中至少一个第一电感器由所述多个导电层的第二部分形成; 以及至少一个导电图案层，其布置在所述侧表面中的至少一个上以形成至少一个第二电感器，其中所述多个导电层中的第三部分与所述至少一个电容器，所述至少一个第一电感器和 所述至少一个第二电感器。
-
公开(公告)号：US10158338B2
公开(公告)日：2018-12-18
申请号：US14549557
申请日：2014-11-21
申请人： CYNTEC CO., LTD.
发明人： Shih-Hsien Tseng
摘要： A circuit structure is disclosed, wherein the circuit structure comprises: a substrate comprising a top surface, a bottom surface and lateral surfaces connecting the top surface and the bottom surface; a plurality of conductive layers disposed over the top surface of the substrate, wherein a dielectric layer is disposed between each two adjacent conductive layers, wherein at least one capacitor is formed by a first portion of the plurality of conductive layers with the dielectric layers therebetween, and wherein at least one first inductor is formed by a second portion of the plurality of conductive layers; and at least one conductive pattern layer disposed over at least one of the lateral surface to form at least one second inductor, wherein a third portion of the plurality of conductive layers electrically connects with said at least one capacitor, said at least one first inductor and said at least one second inductor.
-
公开(公告)号：US20160073491A1
公开(公告)日：2016-03-10
申请号：US14945073
申请日：2015-11-18
申请人： CYNTEC CO., LTD.
CPC分类号： H05K1/0216 , H05K1/00 , H05K1/0233 , H05K1/0243 , H05K1/025 , H05K1/111 , H05K1/181 , H05K5/00 , H05K5/0026 , H05K7/00 , H05K9/0022 , H05K2201/08 , H05K2201/1003
摘要： A network communication device is disclosed. The network communication device includes a circuit board, a network connector, a network chip and a plurality of network magnetic assemblies. The network connector, the network chip and the network magnetic assemblies are disposed on the circuit board. The network magnetic assemblies are electrically connected with the network connector and the network chip, respectively. Each of the network magnetic assemblies includes an Ethernet transformer and at least one inductor. The Ethernet transformer is electrically connected in series with the inductor via a conductive trace of the circuit board. Any two adjacent Ethernet transformers are separately arranged with a gap having a second specific length.
摘要翻译： 公开了一种网络通信设备。 网络通信设备包括电路板，网络连接器，网络芯片和多个网络磁性组件。 网络连接器，网络芯片和网络磁性组件设置在电路板上。 网络磁性组件分别与网络连接器和网络芯片电连接。 每个网络磁性组件包括以太网变压器和至少一个电感器。 以太网变压器通过电路板的导电迹线与电感器串联电连接。 任何两个相邻的以太网变压器分别布置有具有第二特定长度的间隙。
-
公开(公告)号：US20140016289A1
公开(公告)日：2014-01-16
申请号：US13935713
申请日：2013-07-05
申请人： CYNTEC CO., LTD
IPC分类号： H05K1/02
CPC分类号： H05K1/0216 , H05K1/00 , H05K1/0233 , H05K1/0243 , H05K1/025 , H05K1/111 , H05K1/181 , H05K5/00 , H05K5/0026 , H05K7/00 , H05K9/0022 , H05K2201/08 , H05K2201/1003
摘要： A network communication device is disclosed. The network communication device includes a circuit board, a network connector, a network chip and a plurality of network magnetic assemblies. The network connector, the network chip and the network magnetic assemblies are disposed on the circuit board. The network magnetic assemblies are electrically connected with the network connector and the network chip, respectively. Each of the network magnetic assemblies includes an Ethernet transformer and at least one inductor. The Ethernet transformer is electrically connected in series with the inductor via a conductive trace of the circuit board. The spaced distance or a path length of the conductive trace between the Ethernet transformer and the inductor of the at least one network magnetic assembly is less than a first specific length.
摘要翻译： 公开了一种网络通信设备。 网络通信设备包括电路板，网络连接器，网络芯片和多个网络磁性组件。 网络连接器，网络芯片和网络磁性组件设置在电路板上。 网络磁性组件分别与网络连接器和网络芯片电连接。 每个网络磁性组件包括以太网变压器和至少一个电感器。 以太网变压器通过电路板的导电迹线与电感器串联电连接。 以太网变压器和至少一个网络磁性组件的电感器之间的导电迹线的间隔距离或路径长度小于第一特定长度。
-
公开(公告)号：US20240243527A1
公开(公告)日：2024-07-18
申请号：US18413058
申请日：2024-01-16
申请人： CYNTEC CO., LTD.
IPC分类号： H01R13/6585 , H01R12/77 , H01R12/79 , H01R13/6461
CPC分类号： H01R13/6585 , H01R12/771 , H01R12/79 , H01R13/6461
摘要： A connecting structure includes a flexible flat cable. The flexible flat cable includes a first end portion, a second end portion, a connecting portion, a first pad region, a second pad region and a slot. The connecting portion is connected between the first end portion and the second end portion. The first pad region is disposed on the first end portion. The second pad region is disposed on the second end portion. The slot is formed in the connecting portion. The slot is extended along a length direction of the flexible flat cable. The flexible flat cable is a laminated structure including at least one set of signal trace pattern and at least one shielding structure. The at least one shielding structure correspondingly surrounds the at least one set of signal trace pattern in the connecting portion.
-
公开(公告)号：US09226387B2
公开(公告)日：2015-12-29
申请号：US13935713
申请日：2013-07-05
申请人： CYNTEC CO., LTD
IPC分类号： H02B5/00 , H05K7/00 , H05K1/02 , H05K9/00 , H05K1/00 , H05K5/00 , H01H9/28 , H01H27/00 , H01H47/00 , H01H63/00 , H02B7/00 , H02B1/26 , H02B1/00
CPC分类号： H05K1/0216 , H05K1/00 , H05K1/0233 , H05K1/0243 , H05K1/025 , H05K1/111 , H05K1/181 , H05K5/00 , H05K5/0026 , H05K7/00 , H05K9/0022 , H05K2201/08 , H05K2201/1003
摘要： A network communication device is disclosed. The network communication device includes a circuit board, a network connector, a network chip and a plurality of network magnetic assemblies. The network connector, the network chip and the network magnetic assemblies are disposed on the circuit board. The network magnetic assemblies are electrically connected with the network connector and the network chip, respectively. Each of the network magnetic assemblies includes an Ethernet transformer and at least one inductor. The Ethernet transformer is electrically connected in series with the inductor via a conductive trace of the circuit board. The spaced distance or a path length of the conductive trace between the Ethernet transformer and the inductor of the at least one network magnetic assembly is less than a first specific length.
摘要翻译： 公开了一种网络通信设备。 网络通信设备包括电路板，网络连接器，网络芯片和多个网络磁性组件。 网络连接器，网络芯片和网络磁性组件设置在电路板上。 网络磁性组件分别与网络连接器和网络芯片电连接。 每个网络磁性组件包括以太网变压器和至少一个电感器。 以太网变压器通过电路板的导电迹线与电感器串联电连接。 以太网变压器和至少一个网络磁性组件的电感器之间的导电迹线的间隔距离或路径长度小于第一特定长度。
-
公开(公告)号：US20160141102A1
公开(公告)日：2016-05-19
申请号：US14940171
申请日：2015-11-13
申请人： CYNTEC CO., LTD.
CPC分类号： H01F41/042 , H01F17/0013 , H01F27/292
摘要： An electronic component is disclosed, the electronic component comprising: a conductive structure, comprising a plurality of conductive layers separated by a plurality of insulating layers, wherein the plurality of conductive layers and the plurality of insulating layers are stacked in a vertical direction, wherein the plurality of conductive layers forms at least one coil, wherein each of the coil is formed along the vertical direction across said plurality of conductive layers, wherein the plurality of insulating layers are not supported by a substrate.
摘要翻译： 公开了一种电子部件，所述电子部件包括：导电结构，包括由多个绝缘层隔开的多个导电层，其中所述多个导电层和所述多个绝缘层沿垂直方向堆叠，其中， 多个导电层形成至少一个线圈，其中每个线圈沿着垂直方向形成在所述多个导电层上，其中多个绝缘层不被衬底支撑。
-
公开(公告)号：US09148114B2
公开(公告)日：2015-09-29
申请号：US14527785
申请日：2014-10-30
申请人： CYNTEC CO., LTD.
发明人： Shih-Hsien Tseng , Yu-Lin Liao
CPC分类号： H03H7/48 , H03H7/21 , H03H2001/0021 , Y10T29/49099
摘要： A monolithic power splitter is used to split a pair of input differential signals into two pairs of output differential signals in the present invention. The monolithic power splitter has two input terminals to receive a pair of input differential signals, and it has two one-by-two power splitters integrated in one single chip to split a pair of input differential signals into two pairs of output differential signals with equal power. And, the monolithic power splitter has four output terminals to output two pairs of output differential signals. In one embodiment, the first one-by-two power splitter and the second one-by-two power splitter are made on the same surface of the substrate. In another embodiment, the first one-by-two power splitter and the second one-by-two power splitter are made on opposite surfaces of the substrate. The monolithic power splitter can be used as a power combiner based on the reciprocal property of the power splitter circuit.
摘要翻译： 在本发明中，单片功率分配器用于将一对输入差分信号分成两对输出差分信号。 单片功率分配器具有两个输入端子，用于接收一对输入差分信号，并且它具有集成在一个单个芯片中的两个1/2功率分配器，以将一对输入差分信号分成两对输出差分信号 功率。 并且，单片功率分配器具有四个输出端子以输出两对输出差分信号。 在一个实施例中，第一个逐个功率分配器和第二个逐个功率分配器在基板的相同表面上制成。 在另一个实施例中，第一个逐个功率分配器和第二个逐个功率分配器在衬底的相对表面上制成。 单片功率分配器可以基于功率分配器电路的倒数特性用作功率组合器。
-
-
-
-
-
-
-
-
-
搜索结果
12 条记录 (耗时 0.013 秒)
