公开(公告)号：US3237140A

公开(公告)日：1966-02-22

申请号：US28160563

申请日：1963-05-20

Applicant: CTS CORP

Inventor： BARDEN WAYNE A ,  SNYDER CHARLES C

IPC: H01C10/32

CPC classification number: H01C10/32

公开(公告)号：US2958837A

公开(公告)日：1960-11-01

申请号：US83713259

申请日：1959-08-31

Applicant: CTS CORP

Inventor： BARDEN WAYNE A

IPC: H01C10/20

CPC classification number: H01C10/20

公开(公告)号：US3375478A

公开(公告)日：1968-03-26

申请号：US36654264

申请日：1964-05-11

Applicant: CTS CORP

Inventor： BENTHUYSEN JOHN VAN ,  BARDEN WAYNE A

IPC: H01C10/34 ,  H01C10/32

CPC classification number: H01C10/32

公开(公告)号：US2997679A

公开(公告)日：1961-08-22

申请号：US75835058

申请日：1958-09-02

Applicant: CTS CORP

Inventor： BARDEN WAYNE A ,  ARISMAN MERVIN B

IPC: H01C10/40

CPC classification number: H01C10/40

公开(公告)号：US2958748A

公开(公告)日：1960-11-01

申请号：US80911459

申请日：1959-04-27

Applicant: CTS CORP

Inventor： BARDEN WAYNE A ,  ARISMAN MERVIN B

IPC: H01C10/32 ,  H01C10/36 ,  H01H73/30

CPC classification number: H01C10/32 ,  H01C10/36 ,  H01H73/30

公开(公告)号：US3579819A

公开(公告)日：1971-05-25

申请号：US3579819D

申请日：1969-03-24

Applicant: CTS CORP

Inventor： ROZEMA ARTHUR L ,  BRADY LYNN J ,  BARDEN WAYNE A

IPC: H01C7/00 ,  H01C1/084 ,  H01C7/22 ,  H04N3/18 ,  H01C17/00

CPC classification number: H04N3/18 ,  H01C1/084 ,  H01C7/22 ,  Y10T29/49082 ,  Y10T29/49101 ,  Y10T29/49902

Abstract: High-voltage circuit arrangement includes a load connected to a power supply of at least 20,000 volts, and a single discrete high-voltage electrical resistor connected to the power supply and load. The high-voltage resistor comprises a spiral resistive path supported on a ceramic substrate which provides a uniform and continuous heat dissipation path between the ends of the resistor. A heat-dissipating mounting member forms an electrical termination for the resistor, rapidly transfers heat away from the substrate, and includes a substrate alignment surface and seat in close proximity to a surface of the substrate. A threaded portion of the heat-dissipating member is useful for mounting the resistor on a supporting surface and insulative means including an insulative jacket surrounds the substrate. High-voltage corona-inhibiting means include an insulative body that extends one-half inch beyond an end of the resistive path and embeds a lead wire connected to the resistive path. The resistive path is a cermet-film-type material having a resistivity of 5 megohms per square, a voltage coefficient of less than 400 parts per million per volt per square, and a voltage withstanding ability of 3,000 volts per inch of resistive path. The resistive path itself comprises an intersticed mass of inert particles and a conductive phase forming an interstitial mass within the intersticed mass. The method includes the steps of positioning the mounting member and substrate at a work station, compressively centering the substrate on the mounting member with a movable platen, controlling the transfer of heat relative to the mounting member, and soldering the mounting member to the substrate.

公开(公告)号：US3510613A

公开(公告)日：1970-05-05

申请号：US3510613D

申请日：1967-07-10

Applicant: CTS CORP

Inventor： BARDEN WAYNE A ,  ARISMAN MERVIN B

IPC: H01C10/36 ,  H01H21/40 ,  H01H13/26

CPC classification number: H01C10/36 ,  H01H21/40

公开(公告)号：US3469311A

公开(公告)日：1969-09-30

申请号：US3469311D

申请日：1967-11-20

Applicant: CTS CORP

Inventor： BENTHUYSEN JOHN D VAN ,  BARDEN WAYNE A

IPC: H01C10/32 ,  H01C17/00

CPC classification number: H01C10/32 ,  Y10T29/49099

公开(公告)号：US3200657A

公开(公告)日：1965-08-17

申请号：US22656662

申请日：1962-09-27

Applicant: CTS CORP

Inventor： BARDEN WAYNE A ,  ARISMAN MERVIN B

IPC: H01H13/60

CPC classification number: H01H13/60 ,  Y10T74/18888 ,  Y10T74/18896

公开(公告)号：US3196230A

公开(公告)日：1965-07-20

申请号：US22464962

申请日：1962-09-19

Applicant: CTS CORP

Inventor： BARDEN WAYNE A ,  BEUTHUYSEN JOHN D VAN

IPC: H01C10/36 ,  H01H1/24

CPC classification number: H01C10/363 ,  H01H1/242