公开(公告)号：US20240395644A1

公开(公告)日：2024-11-28

申请号：US18669819

申请日：2024-05-21

Applicant: CORNING INCORPORATED

Inventor： Choonkon Kim ,  Hyung Soo Moon ,  Jong-min Yook

IPC: H01L23/15 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498

Abstract: An integrated circuit package is disclosed. The integrated circuit package includes a glass substrate with a glass cladding layer fused to a glass core layer. The glass substrate includes a cavity with a floor defined by the glass core layer and a sidewall defined by the glass cladding layer. The integrated circuit package further includes a metal layer configured to define a continuous path of thermally and electrically conductive material. The metal layer is disposed within the cavity and along a first surface of the glass cladding layer. The first surface faces opposite an interface between the glass core layer and the glass cladding layer. The integrated circuit package further includes an integrated circuit chip disposed within the cavity and contacting a portion of the metal layer within the cavity. The metal layer provides thermal and electrical connection to a bottom (encapsulated) side of the integrated circuit chip.

公开(公告)号：US20240396196A1

公开(公告)日：2024-11-28

申请号：US18713767

申请日：2022-11-18

Applicant: CORNING INCORPORATED

Inventor： Hyeng-cheul Choi ,  Byounggwan Kang ,  Choonkon Kim ,  Hyung Soo Moon

IPC: H01P1/20 ,  B32B7/02 ,  B32B7/12 ,  B32B17/06

Abstract: A substrate assembly includes a first substrate and a second substrate each comprising an inner surface opposite an outer surface, a conductive material layer disposed on the inner surface of the second substrate, and an adhesive layer disposed between the inner surface of the first substrate and the inner surface of the second substrate such that the conductive material layer is positioned between the inner surface of the second substrate and the adhesive layer and the adhesive layer bonds the first substrate to the second substrate, wherein the substrate assembly comprises a reflection coefficient of 0.7 or less.

公开(公告)号：US20250047007A1

公开(公告)日：2025-02-06

申请号：US18718514

申请日：2022-12-08

Applicant: CORNING INCORPORATED ,  POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION

Inventor： Suho Chang ,  Hyeng-cheul Choi ,  Won-bin Hong ,  Byounggwan Kang ,  Choonkon Kim ,  Youngno Youn

IPC: H01Q15/00 ,  H01Q1/36 ,  H01Q1/44 ,  H01Q17/00

Abstract: One or more devices for absorbing electromagnetic radiation are disclosed. The one or more devices include a substrate comprising a glass material. The substrate also includes a first pattern of a metal layer formed on a first surface of the substrate and a second pattern of a metal layer formed on a second surface of the substrate. The first pattern and the second pattern are different and features of the first pattern and the second pattern can be tunable to maximize optical transparency of the one or more devices and to maximize absorption of electromagnetic radiation having a target range of frequencies, such as one or more ranges of frequencies within the microwave portion of the electromagnetic spectrum.