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公开(公告)号：US20190159331A1
公开(公告)日：2019-05-23
申请号：US16098537
申请日：2017-05-04
申请人： CORNELL UNIVERSITY
发明人： Amit Lal , Thomas Schenkel , Arun Persaud , Qing JI , Peter Seidl , Will Waldron , Serhan Ardanuc , Vinaya Kumar Kadayra Basavarajappa
CPC分类号： H05H7/22 , H05H7/02 , H05H7/08 , H05H9/04 , H05H13/00 , H05H2007/025 , H05H2007/045
摘要： A wafer-based charged particle accelerator includes a charged particle source and at least one RF charged particle accelerator wafer sub-assembly and a power supply coupled to the at least one RF charged particle accelerator wafer sub-assembly. The wafer-based charged particle accelerator may further include a beam current-sensor. The wafer-based charged particle accelerator may further include at least a second RF charged particle accelerator wafer sub-assembly and at least one ESQ charged particle focusing wafer. Fabrication methods are disclosed for RF charged particle accelerator wafer sub-assemblies, ESQ charged particle focusing wafers, and the wafer-based charged particle accelerator.
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公开(公告)号：US20200187344A1
公开(公告)日：2020-06-11
申请号：US16538563
申请日：2019-08-12
申请人： Cornell University
发明人： Amit Lal , Thomas Schenkel , Arun Persaud , Qing Ji , Peter Seidl , Will Waldron , Serhan Ardanuc , Vinaya Kumar Kadayra Basavarajappa
摘要： A wafer-based charged particle accelerator includes a charged particle source and at least one RF charged particle accelerator wafer sub-assembly and a power supply coupled to the at least one RF charged particle accelerator wafer sub-assembly. The wafer-based charged particle accelerator may further include a beam current-sensor. The wafer-based charged particle accelerator may further include at least a second RF charged particle accelerator wafer sub-assembly and at least one ESQ charged particle focusing wafer. Fabrication methods are disclosed for RF charged particle accelerator wafer sub-assemblies, ESQ charged particle focusing wafers, and the wafer-based charged particle accelerator.
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公开(公告)号：US10912184B2
公开(公告)日：2021-02-02
申请号：US16538563
申请日：2019-08-12
申请人： Cornell University
发明人： Amit Lal , Thomas Schenkel , Arun Persaud , Qing Ji , Peter Seidl , Will Waldron , Serhan Ardanuc , Vinaya Kumar Kadayra Basavarajappa
摘要： A wafer-based charged particle accelerator includes a charged particle source and at least one RF charged particle accelerator wafer sub-assembly and a power supply coupled to the at least one RF charged particle accelerator wafer sub-assembly. The wafer-based charged particle accelerator may further include a beam current-sensor. The wafer-based charged particle accelerator may further include at least a second RF charged particle accelerator wafer sub-assembly and at least one ESQ charged particle focusing wafer. Fabrication methods are disclosed for RF charged particle accelerator wafer sub-assemblies, ESQ charged particle focusing wafers, and the wafer-based charged particle accelerator.
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公开(公告)号：US10383205B2
公开(公告)日：2019-08-13
申请号：US16098537
申请日：2017-05-04
申请人： CORNELL UNIVERSITY
发明人： Amit Lal , Thomas Schenkel , Arun Persaud , Qing Ji , Peter Seidl , Will Waldron , Serhan Ardanuc , Vinaya Kumar Kadayra Basavarajappa
摘要： A wafer-based charged particle accelerator includes a charged particle source and at least one RF charged particle accelerator wafer sub-assembly and a power supply coupled to the at least one RF charged particle accelerator wafer sub-assembly. The wafer-based charged particle accelerator may further include a beam current-sensor. The wafer-based charged particle accelerator may further include at least a second RF charged particle accelerator wafer sub-assembly and at least one ESQ charged particle focusing wafer. Fabrication methods are disclosed for RF charged particle accelerator wafer sub-assemblies, ESQ charged particle focusing wafers, and the wafer-based charged particle accelerator.
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