公开(公告)号：USD917460S1

公开(公告)日：2021-04-27

申请号：US29637089

申请日：2018-02-13

Applicant: COMPAL ELECTRONICS, INC.

Designer： Chun-Wen Wang ,  Wang-Hung Yeh ,  Hsin-Chieh Fang ,  Che-Hsien Lin ,  Shu-Hung Lin ,  Che-Hsien Chu ,  Ming-Chung Liu ,  Tung-Ying Wu

公开(公告)号：USD915394S1

公开(公告)日：2021-04-06

申请号：US29627032

申请日：2017-11-22

Applicant: COMPAL ELECTRONICS, INC.

Designer： Che-Hsien Lin ,  Hsin-Chieh Fang ,  Wang-Hung Yeh ,  Shu-Hong Lin ,  Chun-Wen Wang ,  Che-Hsien Chu

公开(公告)号：US11379015B2

公开(公告)日：2022-07-05

申请号：US17103952

申请日：2020-11-25

Applicant: COMPAL ELECTRONICS, INC.

Inventor： Che-Hsien Lin ,  Che-Hsien Chu

IPC: G06F1/16

Abstract: An electronic device including a first body, a second body, a hinge structure, a first functional assembly, and a first linkage structure is provided. The first body and the second body are pivotally connected to each other by the hinge structure. The first functional assembly is movably arranged on the first body. The first linkage structure is connected between the hinge structure and the first functional assembly, wherein the first linkage structure is adapted for driving the first functional assembly to move relative to the first body with the relative rotation of the first body and the second body.

公开(公告)号：US20210064084A1

公开(公告)日：2021-03-04

申请号：US17010835

申请日：2020-09-03

Applicant: COMPAL ELECTRONICS, INC.

Inventor： Che-Hsien Lin ,  Ko-Yen Lu ,  Che-Hsien Chu

IPC: G06F1/16

Abstract: A foldable electronic device includes a first body, a second body, a dual-axis hinge module, a first linkage mechanism, a second linkage mechanism, a first object and a second object. The dual-axis hinge module is disposed between the first body and the second body. The first linkage mechanism is disposed to the first body and is coupled to the dual-axis hinge module. The second linkage mechanism is disposed to the second body and is coupled to the dual-axis hinge module. The first object is slidably disposed to the first body and connected to the first linkage mechanism. The second object is slidably disposed to the second body and connected to the second linkage mechanism.

公开(公告)号：US11983045B2

公开(公告)日：2024-05-14

申请号：US17086459

申请日：2020-11-02

Applicant: COMPAL ELECTRONICS, INC.

Inventor： Che-Hsien Lin ,  Che-Hsien Chu ,  Ko-Yen Lu

IPC: G06F1/16 ,  H05K5/02 ,  H05K5/03

CPC classification number: G06F1/1681 ,  G06F1/1618 ,  H05K5/0226 ,  H05K5/03

Abstract: An electronic device includes two bodies, at least one hinge structure, a functional assembly, and at least one linkage structure. The two bodies are pivotally connected to each other through the hinge structure. The functional assembly is movably disposed on one of the two bodies. The linkage structure is connected between the two bodies, and the functional assembly is connected to the linkage structure. The linkage structure is adapted to drive the functional assembly to move relative to the corresponding body as the two bodies are rotated relative to each other.

公开(公告)号：USD915395S1

公开(公告)日：2021-04-06

申请号：US29637095

申请日：2018-02-13

Applicant: COMPAL ELECTRONICS, INC.

Designer： Chun-Wen Wang ,  Wang-Hung Yeh ,  Hsin-Chieh Fang ,  Che-Hsien Lin ,  Shu-Hung Lin ,  Che-Hsien Chu