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公开(公告)号：US11165005B2
公开(公告)日：2021-11-02
申请号：US16342446
申请日：2017-10-16
Inventor： Adrien Gasse , David Henry , Bertrand Chambion
Abstract: The invention relates to a method for producing a first microelectronic chip including a layer of interest having a connection face, intended to be hybridized with a second microelectronic chip. The method including depositing a layer of adhesive on a face of the layer of interest opposite to the first connection face and fastening a handle layer to the layer of adhesive. The method also includes, prior to the steps of depositing the adhesive and fastening the handle layer, defining, on the one hand, a maximum thickness eccmax and a minimum value Eccmin and a maximum value Eccmax of the Young's modulus for the layer of adhesive, and, on the other hand, the minimum thickness ecpmin for the handle layer.
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公开(公告)号：US09900700B2
公开(公告)日：2018-02-20
申请号：US14915749
申请日：2014-09-04
Inventor： Fabrice Casset , Remy Dejaeger , Stephane Fanget , David Henry , Quentin Leclere
CPC classification number: H04R7/26 , H04R1/005 , H04R17/00 , H04R31/00 , H04R2201/003 , H04R2307/201 , H04R2307/207
Abstract: A digital acoustic device including: at least one suspended diaphragm facing a support and at least one actuator associated with the diaphragm, the associated actuator being configured to move the diaphragm away from and/or closer to the support; a stop mechanism configured to interrupt movement of the diaphragm further to activating the actuator when the diaphragm has a non-zero speed, the stop mechanism being sized to interrupt the movement of the diaphragm when the movement of the diaphragm is greater than or equal to 50% of the theoretical maximum stroke of the diaphragm and lower than or equal to 95% of the theoretical maximum stroke of the diaphragm.
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