公开(公告)号：US11602047B2

公开(公告)日：2023-03-07

申请号：US17380121

申请日：2021-07-20

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yin-Chen Lin ,  Ming-Hsiao Ke ,  Hui-Yu Huang ,  Chih-Ming Peng ,  Chun-Te Lee

IPC: H05K1/03 ,  H05K13/02 ,  H05K13/04

Abstract: A circuit board tape includes substrate units each including a sprocket-hole region, a layout region and a joining mark. There are odd and more than three sprocket holes on the sprocket-hole region. An imaginary line extended from the joining mark is extended to between a first layout and a second layout located on the layout region. The amount of the sprocket holes between the imaginary lines of the adjacent substrate units is odd. The circuit board tape is cut along the imaginary lines of the different substrate units so as to remove the defective substrate unit from the circuit board tape and divide the circuit board tape into a front tape and a rear tape. After joining the front and rear tapes, the region where a first layout on the front tape and a second layout on the rear tape are located is defined as a combined layout region.

公开(公告)号：US20220087017A1

公开(公告)日：2022-03-17

申请号：US17380121

申请日：2021-07-20

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yin-Chen Lin ,  Ming-Hsiao Ke ,  Hui-Yu Huang ,  Chih-Ming Peng ,  Chun-Te Lee

IPC: H05K1/03 ,  H05K13/04 ,  H05K13/02

Abstract: A circuit board tape includes substrate units each including a sprocket-hole region, a layout region and a joining mark. There are odd and more than three sprocket holes on the sprocket-hole region. An imaginary line extended from the joining mark is extended to between a first layout and a second layout located on the layout region. The amount of the sprocket holes between the imaginary lines of the adjacent substrate units is odd. The circuit board tape is cut along the imaginary lines of the different substrate units so as to remove the defective substrate unit from the circuit board tape and divide the circuit board tape into a front tape and a rear tape. After joining the front and rear tapes, the region where a first layout on the front tape and a second layout on the rear tape are located is defined as a combined layout region.

公开(公告)号：US09247635B2

公开(公告)日：2016-01-26

申请号：US14317254

申请日：2014-06-27

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yi-Wen Chen ,  Yin-Chen Lin ,  Ming-Hsiao Ke ,  Yu-Chen Ma

IPC: H05K1/00 ,  H05K1/02

CPC classification number: H05K1/0269 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/0298 ,  H05K2201/09781 ,  H05K2201/0989 ,  H05K2201/09936

Abstract: A flexible substrate includes a base layer, a metallic layer, a solder mask layer and an identifying code, the metallic layer is disposed at a first surface of the base layer, the metallic layer comprises a plurality of traces and at least one bottom block used for defining marked position, wherein the traces and the at least one bottom block are covered with the solder mask layer, wherein above the perpendicular direction of the at least one bottom block of the metallic layer, a pre-marked area is defined on an exposing surface of the solder mask layer and by an outlined edge of the at least one bottom block, and the identifying code is formed within the pre-marked area of the solder mask layer.

Abstract translation: 柔性基板包括基底层，金属层，焊接掩模层和识别代码，金属层设置在基底层的第一表面，金属层包括多个迹线和至少一个使用的底部块 用于限定标记位置，其中所述迹线和所述至少一个底部块被所述焊接掩模层覆盖，其中在所述金属层的所述至少一个底部块的垂直方向上方，预先标记的区域被限定在曝光 焊料掩模层的表面和至少一个底部块的轮廓边缘，并且识别代码形成在焊料掩模层的预先标记的区域内。

公开(公告)号：US20150359085A1

公开(公告)日：2015-12-10

申请号：US14317254

申请日：2014-06-27

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yi-Wen Chen ,  Yin-Chen Lin ,  Ming-Hsiao Ke ,  Yu-Chen Ma

IPC: H05K1/02

CPC classification number: H05K1/0269 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/0298 ,  H05K2201/09781 ,  H05K2201/0989 ,  H05K2201/09936

Abstract: A flexible substrate includes a base layer, a metallic layer, a solder mask layer and an identifying code, the metallic layer is disposed at a first surface of the base layer, the metallic layer comprises a plurality of traces and at least one bottom block used for defining marked position, wherein the traces and the at least one bottom block are covered with the solder mask layer, wherein above the perpendicular direction of the at least one bottom block of the metallic layer, a pre-marked area is defined on an exposing surface of the solder mask layer and by an outlined edge of the at least one bottom block, and the identifying code is formed within the pre-marked area of the solder mask layer.

Abstract translation: 柔性基板包括基底层，金属层，焊接掩模层和识别代码，金属层设置在基底层的第一表面，金属层包括多个迹线和至少一个使用的底部块 用于限定标记位置，其中所述迹线和所述至少一个底部块被所述焊接掩模层覆盖，其中在所述金属层的所述至少一个底部块的垂直方向上方，预先标记的区域被限定在曝光 焊料掩模层的表面和至少一个底部块的轮廓边缘，并且识别代码形成在焊料掩模层的预先标记的区域内。